This series of circuits provides designers with a quick source for measuring circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information. - Ready-to-use circuits - Grouped by application for easy look-up - Circuit source listings

This ready reference provides electrical engineers with practical information on accurate methods for measuring signals and noise in electronic circuits as well as methods for locating and reducing high frequency noise generated by circuits or external interference. Engineers often find that measuring and mitigating high frequency noise signals in electronic circuits can be problematic when utilizing common measurement methods. Demonstrating the innovative solutions he developed as a Distinguished Member of Technical Staff at AT&T/Bell Laboratories, solutions which earned him numerous U.S. and foreign patents, Douglas Smith has written the most definitive work on this subject. Smith explains design problems related to the new high frequency electronic standards, and then systematically provides laboratory proven methods for making accurate noise measurements, while demonstrating how these results should be interpreted. The technical background needed to conduct these experiments is provided as an aid to the novice, and as a reference for the professional. Smith also discusses theoretical concepts as they relate to practical applications. Many of the techniques Smith details in this book have been previously unpublished, and have been proven to solve problems in hours rather than in the days or weeks of effort it would take conventional techniques to yield results. Comprehensive and informative, this volume provides detailed coverage of such areas as: scope probe impedance, grounding, and effective bandwidth, differential measurement techniques, noise source location and identification, current probe characteristics, operation, and applications, characteristics of sources of interference to measurements and the minimization of their effects, minimizing coupling of external noise into the equipment under test by measurements, estimating the effect of a measurement on equipment operation, using digital scopes for single shot noise measurements, prediction of equipment electromagnetic interference (EMI) emission and susceptibility of performance, null experiments for validating measurement data, the relationship between high frequency noise and final product reliability. With governmental regulations and MIL standards now governing the emission of high frequency electronic noise and the susceptibility to pulsed EMI, the information presented in this guide is extremely pertinent. Electrical engineers will find High Frequency Measurements and Noise in Electronic Circuits an essential desktop reference for information and solutions, and engineering students will rely on it as a virtual source book for deciphering the "mysteries" unique to high frequency electronic circuits.

Highlighting the challenges RF and microwave circuit designers face in their day-to-day tasks, RF and Microwave Circuits, Measurements, and Modeling explores RF and microwave circuit designs in terms of performance and critical design specifications. The book discusses transmitters and receivers first in terms of functional circuit block and then examines each block individually. Separate articles consider fundamental amplifier issues, low noise amplifiers, power amplifiers for handset applications and high power, power amplifiers. Additional chapters cover other circuit functions including oscillators, mixers, modulators, phase locked loops, filters and multiplexers. New chapters discuss high-power PAs, bit error rate testing, and nonlinear modeling of heterojunction bipolar transistors, while other chapters feature new and updated material that reflects recent progress in such areas as high-volume testing, transmitters and receivers, and CAD tools. The unique behavior and requirements associated with RF and microwave systems establishes a need for unique and complex models and simulation tools. The required toolset for a microwave circuit designer includes unique device models, both 2D and 3D electromagnetic simulators, as well as frequency domain based small signal and large signal circuit and system simulators. This unique suite of tools requires a design procedure that is also distinctive. This book examines not only the distinct design tools of the microwave circuit designer, but also the design procedures that must be followed to use them effectively.

An elective course in the final-year BEng progamme in electronic engin eering in the City Polytechnic of Hong Kong was generated in response to the growing need of local industry for graduate engineers capable of designing circuits and performing measurements at high frequencies up to a few gigahertz. This book has grown out from the lecture and tutorial materials written specifically for this course. This course should, in the opinion of the author, best be conducted if students can take a final-year design project in the same area. Examples of projects in areas related to the subject matter of this book which have been completed successfully in the last two years that the course has been run include: low-noise amplifiers, dielectric resonator-loaded oscillators and down converters in the 12 GHz as well as the 1 GHz bands; mixers; varactor-tuned and non-varactor-tuned VCOs; low-noise and power amplifiers; and filters and duplexers in the 1 GHz, 800 MHz and 500 MHz bands. The book is intended for use in a course of forty lecture hours plus twenty tutorial hours and the prerequisite expected of the readers is a general knowledge of analogue electronic circuits and basic field theory. Readers with no prior knowledge in high-frequency circuits are recom mended to read the book in the order that it is arranged. ~ ______ In_t_ro_d_u_c_tl_·o_n ______ ~1 ~ 1.

The volume includes a set of selected papers extended and revised from the 2011 International Conference on Mechanical Engineering and Technology, held on London, UK, November 24-25, 2011. Mechanical engineering technology is the application of physical principles and current technological developments to the creation of useful machinery and operation design. Technologies such as solid models may be used as the basis for finite element analysis (FEA) and / or computational fluid dynamics (CFD) of the design. Through the application of computer-aided manufacturing (CAM), the models may also be used directly by software to create "instructions" for the manufacture of objects represented by the models, through computer numerically controlled (CNC) machining or other automated processes, without the need for intermediate drawings. This volume covers the subject areas of mechanical engineering and technology, and also covers interdisciplinary subject areas of computers, communications, control and automation. We hope that researchers, graduate students and other interested readers benefit scientifically from the book and also find it stimulating in the process.

This book describes means in improving the technology of LSI/VLSI ICs production. It does so by concentrating on improvements of manufacturing yield and quality of the products by detecting weak points which should be eliminated on the way up the learning curve. The book presents a systematic approach to the problem, covering primarily methods based on the use of test patterns measurements, in both mass production and in research and development activities. The main groups of defects found in IC chips and ways to detect them using test structures are discussed in detail.

Hybrid microelectronics containing both conventional electronic components and high-temperature superconductive films have been designed, fabricated, and tested. The devices operate from room temperature to 75K and perform d.c. four-probe resistance measurements on six superconductive specimens resident on each circuit. Four of these hybrid circuits were incorporated into the Materials In Devices As Superconductors (MIDAS) spaceflight experiment and evaluated over a 90-day period on the Mir space station. Prior to launch, comprehensive testing of the flight circuits was performed to determine the effects of thermal cycling, vibration loads, and long-term operation on circuit performance. This report describes the fabrication and assembly procedures used to produce the hybrid circuits, the techniques used to integrate the circuits into the MIDAS hardware system, and the results of pre-flight evaluations which verified circuit functionality.