This book introduces the fundamental concepts of inverse heat transfer problems. It presents in detail the basic steps of four techniques of inverse heat transfer protocol, as a parameter estimation approach and as a function estimation approach. These techniques are then applied to the solution of the problems of practical engineering interest involving conduction, convection, and radiation. The text also introduces a formulation based on generalized coordinates for the solution of inverse heat conduction problems in two-dimensional regions.

This series provides the chemical physics field with a forum for critical, authoritative evaluations of advances in every area of the discipline. Volume 129 in the series continues to report recent advances with significant, up-to-date chapters by internationally recognized researchers.

This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

"The International Conference on Heterogeneous Material Mechanics (ICHMM) in Huangshan, China, June 3-8, 2008 follows the successful inaugural ICHMM held in ChongQing, China in June, 2004. The ICHMM series is the first international forum that focuses exclusively on various issues related to the behavior of heterogeneous materials in a broad sense. The object of the ICHMM is to present and publicize integrated scientific and engineering approaches to the measurement and modeling of phenomena at the interface of materials science, physics, chemistry, biology, and solid mechanics."--Preface, p. xxxix.

Fundamentals of Heat and Mass Transfer, 7th Edition is the gold standard of heat transfer pedagogy for more than 30 years, with a commitment to continuous improvement by four authors having more than 150 years of combined experience in heat transfer education, research and practice. Using a rigorous and systematic problem-solving methodology pioneered by this text, it is abundantly filled with examples and problems that reveal the richness and beauty of the discipline. This edition maintains its foundation in the four central learning objectives for students and also makes heat and mass transfer more approachable with an additional emphasis on the fundamental concepts, as well as highlighting the relevance of those ideas with exciting applications to the most critical issues of today and the coming decades: energy and the environment. An updated version of Interactive Heat Transfer (IHT) software makes it even easier to efficiently and accurately solve problems.

This two-volume set presents the proceedings from the 8th International Symposium on Transport Phenomena in Combustion. There are more than 150 chapters that provide an extensive review of topics such as complete numerical simulation of combustion and heat transfer in furnaces and boilers, the interaction of combustion and heat transfer in porous media for low emission, high efficiency applications, industrial combustion technology, experimental and diagnostic methods and active combustion control, and fire research, internal combustion engine, Nox and soot emission.

Through analyses, experimental results, and worked-out numerical examples, Microscale and Nanoscale Heat Transfer: Fundamentals and Engineering Applications explores the methods and observations of thermophysical phenomena in size-affected domains. Compiling the most relevant findings from the literature, along with results from their own re

This book offers a comprehensive review of the state-of-the-art in innovative Beyond-CMOS nanodevices for developing novel functionalities, logic and memories dedicated to researchers, engineers and students. It particularly focuses on the interest of nanostructures and nanodevices (nanowires, small slope switches, 2D layers, nanostructured materials, etc.) for advanced More than Moore (RF-nanosensors-energy harvesters, on-chip electronic cooling, etc.) and Beyond-CMOS logic and memories applications.