Vintage postcards and photographs depict the history of this Arkansas resort, Hot Springs. From its rise in the 1800s until well into the twentieth century, Hot Springs was a famed resort known worldwide. The grand hotels and world-class bath houses that sprang up around the government-protected springs drew countless visitors, ranging from the famous and wealthy to those of humble means, all seeking the health and pleasure promised by the Spa City's promoters. In the words of a railroad tourist guidebook from about 1910, "A stay at Hot Springs, be it ever so brief, always remains a pleasant memory afterward. It was the writer's good fortune to spend a few days at this popular resort--not as an invalid, I am happy to say, but as a tourist--and I certainly never bathed in more delightful water than that which flows so abundantly from the hot springs of Arkansas. There is buoyancy, a magnetism about it that is simply indescribable." Such has been the experience of countless visitors over the years. Readers will find much of the history of this storied resort in Hot Springs, Arkansas, which is profusely illustrated with vintage postcards and photographs, all carefully interpreted by the authors, Ray and Steven Hanley, with research assistance from Mark Blaeuer of the Hot Springs National Park staff.

As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level should be based on both the failure mode analysis and the basic understanding of the physical failure mechanisms observed in integrated circuits. Hot-carrier induced degrada tion of MOS transistor characteristics is one of the primary mechanisms affecting the long-term reliability of MOS VLSI circuits. It is likely to become even more important in future generation chips, since the down ward scaling of transistor dimensions without proportional scaling of the operating voltage aggravates this problem. A thorough understanding of the physical mechanisms leading to hot-carrier related degradation of MOS transistors is a prerequisite for accurate circuit reliability evaluation. It is also being recognized that important reliability concerns other than the post-manufacture reliability qualification need to be addressed rigorously early in the design phase. The development and use of accurate reliability simulation tools are therefore crucial for early assessment and improvement of circuit reliability : Once the long-term reliability of the circuit is estimated through simulation, the results can be compared with predetermined reliability specifications or limits. If the predicted reliability does not satisfy the requirements, appropriate design modifications may be carried out to improve the resistance of the devices to degradation.

In this cookbook, you’ll find a variety of recipes that showcase the versatility of chili in different types of dishes, including appetizers, soups, stews, main courses, and even desserts.

Hot Isostatic Pressing (HIP) has important applications in advanced materials manufacturing, automotive, aerospace, oil and gas industries, power generation, and medical and nuclear fields. The symposium focused on HIP applications in such areas as material optimization, radioactive nuclear waste, cast aluminum alloys, ceramic materials, superalloys, manufacturing of turbine blisks, densification of additive manufactured parts, diffusion welding of dissimilar metals and alloys, heat treatment inside the HIP unit, turbopump components, improved tooling materials, valve spindles for engines, Ni-base superalloys, titanium aluminide, stainless steels, metal matrix composites, phase transformations, uniform load cooling equipment, duplex steel, diamond/SiC composites, large hot zone units, additive manufacturing, efficient modeling, reactor vessel fabrication, electron beam welding, superconducting magnet structures.

This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.

This volume examines the current state of knowledge concerning the influence of a hot environment on nutrient requirements of military personnel. A parallel concern is ensuring that performance does not decline as a result of inadequate nutrition. The committee provides a thorough review of the literature in this area and interprets the diverse data in terms of military applications. In addition to a focus on specific nutrient needs in hot climates, the committee considers factors that might change food intake patterns and therefore overall calories. Although concern for adequate nutrition for U.S. soldiers in Saudi Arabia prompted the initiation of this project, its scope includes the nutrient needs of individuals who may be actively working in both hot-dry and hot-moist climates.