This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

PROFINET is the first integrated Industrial Ethernet Standard for automation, and utilizes the advantages of Ethernet and TCP/IP for open communication from the corporate management level to the process itself. PROFINET CBA divides distributed, complex applications into autonomous units of manageable size. Existing fieldbuses such as PROFIBUS and AS-Interface can be integrated using so-called proxies. This permits separate and cross-vendor development, testing and commissioning of individual plant sections prior to the integration of the solution as a whole. PROFINET IO, with its particularly fast real-time communication, fulfills all demands currently placed on the transmission of process data and enables easy integration of existing fieldbus systems. Isochronous real-time (IRT) is used for isochronous communication in motion control applications. PROFINET depends on established IT standards for network management and teleservice. Particulary to automation control engineering it offers a special security concept. Special industrial network technology consisting of active network components, cables and connection systems, together with recommendations for installation, complete the concept. This book serves as an introduction to PROFINET technology. Configuring engineers, commissioning engineers and technicians are given an overview of the concept and the fundamentals they need to solve PROFINET-based automation tasks. Technical relationships and practical applications are described using SIMATIC products as example.

In response to the increasing interest in developing photonic switching fabrics, this book gives an overview of the many technologies from a systems designer's perspective. Optically transparent devices, optical logic devices, and optical hardware are all discussed in detail and set into a systems context. Comprehensive, up-to-date, and profusely illustrated, the work will provide a foundation for the field, especially as broadband services are more fully developed.

This is the first of three Gmelin Handbook volumes in the silicon se ries that will cover silicon nitride, a normaUy solid material with the idealized formula Si N . This volume, 3 4 "Silicon" Supplement Volume B Sc, is devoted to applications of silicon nitride in microelec tronics and solar ceUs. The compendium is the product of a critical selection among more than 17600 publications on silicon nitride issued up to January 1990. Out of a total of 5900 publications dealing with the fabrication and use of microelectronic devices (including 2400 Japanese patent applications), about 4000 papers have been selected for this volume. The current volume is grouped into three parts. Chapters 2 to 8 deal with general, non specific microelectronic applications of silicon nitride, Chapters 9 to 31 cover applications of silicon nitride in specific devices and device components, and Chapter 32 is devoted exclusively to applications in solar ceUs, including information on our general understanding of the role of silicon nitride in photovoltaic devices. Experimental results on the preparation of silicon nitride layers for application in unspeci fied devices are in Chapter 2. Whenever the preparation is in connection with specific devices, the information is presented in the respective chapters. The general preparation of silicon nitride layers is not covered in this volume, but will appear in "Silicon" Supplement Volume B 5a. See also the Introductory Remarks, Chapter 1, p. 1.

Due to the dramatic increase in competition over the last few years, it has become more and more important for Internet Service Providers (ISPs) to run an efficient business and offer an adequate Quality of Service. The Competitive Internet Service Provider is a comprehensive guide for those seeking to do just that. Oliver Heckmann approaches the issue from a system point of view, looking not only at running a network, but also at connecting the network with peering and transit partners or planning the expansion of the network. The Competitive Internet Service Provider: Offers an advanced reference on the topic, drawing on state-of-the art research in network technology. Clearly defines the criteria enabling ISPs to operate with the greatest efficiency and deliver adequate Quality of Service. Discusses the implications of the future multiservice Internet and multimedia applications such as Voice over IP, peer-to-peer, or network games. Delivers a comparative evaluation of different feasible Quality of Service approaches. Explores scientific methods such as queuing theory, network calculus, and optimization theory. Illustrates concepts throughout with mathematical models and simulations. This invaluable reference will provide academic and industrial researchers in the field of network and communications technology, graduate students on telecommunications courses, as well as ISP managers, engineers and technicians, equipment manufacturers and consultants, with an understanding of the concepts and issues involved in running a successful ISP.

Global energy network is an important platform to guarantee effective exploitation of global clean energy and ensure reliable energy supply for everybody. Global Energy Interconnection analyzes the current situation and challenges of global energy development, provides the strategic thinking, overall objective, basic pattern, construction method and development mode for the development of global energy network. Based on the prediction of global energy and electricity supply and demand in the future, with the development of UHV AC/DC and smart grid technologies, this book offers new solutions to drive the safe, clean, highly efficient and sustainable development of global energy. The concept and development ideas concerning global energy interconnection in this book are based on the author's thinking of strategic issues about China's and the world's energy and electricity development for many years, especially combined with successful practices of China's UHV development. This book is particularly suitable for researchers and graduated students engaged in energy sector, as well as energy economics researchers, economists, consultants, and government energy policy makers in relevant fields. - Based on the author's many years' experience in developing Smart Grid solutions within national and international projects. - Combines both solid background information and cutting-edge technology progress, coupled with a useful and impressive list of references. - The key energy problems which are challenging us nowadays are well stated and explained in this book, which facilitates a better understanding of the development of global energy interconnection with UHV AC/DC and smart grid technologies.

From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.

Identity, Morality, and Threat offers a critical examination of the social psychological processes that generate outgroup devaluation and ingroup glorification as the source of conflict. Dr. Daniel Rothbart and Dr. Karina Korostelina bring together essays analyzing the causal relationship between escalating violence and opposing images of the Self and Other. The essays confront the practice of demonizing the Other as a justification for violent conflict and the conditions that enable these distorted images to shape future decisions. The authors provide insight into the possibilities for transforming threat-narratives into collaboration-narratives, and for changing past opposition into mutual understanding. Identity, Morality, and Threat is a strong contribution to the study of identity-based conflict and psychological defenses.