Crucial Issues In Semiconductor Materials And Processing Technologies

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Semiconductors lie at the heart of some of the most important industries and technologies of the twentieth century. The complexity of silicon integrated circuits is increasing considerably because of the continuous dimensional shrinkage to improve efficiency and functionality. This evolution in design rules poses real challenges for the materials scientists and processing engineers. Materials, defects and processing now have to be understood in their totality. World experts discuss, in this volume, the crucial issues facing lithography, ion implication and plasma processing, metallization and insulating layer quality, and crystal growth. Particular emphasis is placed upon silicon, but compound semiconductors and photonic materials are also highlighted. The fundamental concepts of phase stability, interfaces and defects play a key role in understanding these crucial issues. These concepts are reviewed in a crucial fashion.

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Genre : Technology & Engineering
Author : S. Coffa
Publisher : Springer Science & Business Media
Release : 2012-12-06
File : 523 Pages
ISBN-13 : 9789401127141


Proceedings Of The 3rd International Conference On Advances In Materials Processing Challenges And Opportunities

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This book presents peer reviewed articles from the 3rd International Conference on Advances in Materials Processing: Challenges and Opportunities (AMPCO 2022), held at IIT Roorkee, India. It highlights recent progress made in the fields of materials processing, advanced steel technology and materials for sustainability. The conference is also special as it is being organized on the occasion of 60 years of the department of metallurgical and materials engineering as well as 175 years of IIT Roorkee. ​

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Genre : Science
Author : Abhishek Tewari
Publisher : Springer Nature
Release : 2023-07-09
File : 263 Pages
ISBN-13 : 9789819919710


Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die Attach And Wafer Bonding Technology A 4 Volume Set

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Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

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Genre : Technology & Engineering
Author :
Publisher : World Scientific
Release : 2019-08-27
File : 1079 Pages
ISBN-13 : 9789811209642


Advancements In Materials Processing Technology Volume 1

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Genre :
Author : Rina Sahu
Publisher : Springer Nature
Release :
File : 332 Pages
ISBN-13 : 9789819749584


New Materials Society Challenges And Opportunities

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Covers: new materials technology overview; advanced metals (magnetic alloys, superalloys, powdered metals, & more); metal matrix composites; advanced ceramic materials (techniques & applications); advanced polymer materials (description of engineering & high performance polymers) & glossary of terms. Black & white photos, graphs & tables.

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Author : DIANE Publishing Company
Publisher : DIANE Publishing
Release : 1993-07
File : 300 Pages
ISBN-13 : 0788101471


Sige Ge And Related Compounds 6 Materials Processing And Devices

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Genre :
Author : D. Harame
Publisher : The Electrochemical Society
Release :
File : 1042 Pages
ISBN-13 : 9781607685432


Analytical And Diagnostic Techniques For Semiconductor Materials Devices And Processes

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.".. ALTECH 2003 was Symposium J1 held at the 203rd Meeting of the Electrochemical Society in Paris, France from April 27 to May 2, 2003 ... Symposium M1, Diagnostic Techniques for Semiconductor Materials and Devices, was part of the 202nd Meeting of the Electrochemical Society held in Salt Lake City, Utah, from October 21 to 25, 2002 ..."--p. iii.

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Genre : Technology & Engineering
Author : Bernd O. Kolbesen
Publisher : The Electrochemical Society
Release : 2003
File : 572 Pages
ISBN-13 : 1566773482


Functional Materials Processing For Switchable Device Modulation

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Functional Materials Processing for Switchable Device Modulation focuses on the advances of nanofabrication that underpin emerging technologies, including electronic devices. The book provides readers with a broad view of the materials' perspectives, including historical context and background, along with future opportunities for smart electronic and switchable devices. A major focus in the book is on the research and development of synthetic materials for spectroscopic analysis which broadly deals with science and technology of materials on the atomic and molecular scale. The book reviews the materials and advances in research for switchable electronics for bioelectronic, sensing and optoelectronic applications. In addition, key challenges and emerging opportunities in innovations in surface modification and novel functional materials device implementation for industrial scale reproducibility are discussed. The book covers the applications and market potential for a variety of media, including mirrors, glazing/coatings, and display products. The physics, electrochemistry, device design and materials are detailed, with performance compared between the most relevant and emerging switchable technologies. - Addresses the most interesting advances in switchable devices for bioelectronics, electronics, optoelectronics and sensing applications - Includes a special emphasis on materials design, processing and fabrication of switchable devices to realize large-scale industry applications - Compares the performance of existing innovative switchable devices - Reviews the remaining barriers to commercialization, along with opportunities to address these challenges

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Genre : Technology & Engineering
Author : Kaushik Pal
Publisher : Woodhead Publishing
Release : 2021-10-19
File : 290 Pages
ISBN-13 : 9780128242339


Handbook Of Green Materials Processing Technologies Properties And Applications In 4 Volumes

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Green materials and green nanotechnology have gained widespread interest over the last 15 years; first in academia, then in related industries in the last few years.The Handbook of Green Materials serves as reference literature for undergraduates and graduates studying materials science and engineering, composite materials, chemical engineering, bioengineering and materials physics; and for researchers, professional engineers and consultants from polymer or forest industries who encounter biobased nanomaterials, bionanocomposites, self- and direct-assembled nanostructures and green composite materials in their lines of work.This four-volume set contains material ranging from basic, background information on the fields discussed, to reports on the latest research and industrial activities, and finally the works by contributing authors who are prominent experts of the subjects they address in this set.The four volumes comprise of:The first volume explains the structure of cellulose; different sources of raw material; the isolation/separation processes of nanomaterials from different material sources; and properties and characteristics of cellulose nanofibers and nanocrystals (starch nanomaterials). Information on the different characterization methods and the most important properties of biobased nanomaterials are also covered. The industrial point of view regarding both the processability and access of these nanomaterials, as well as large scale manufacturing and their industrial application is discussed — particularly in relation to the case of the paper industry.The second volume expounds on different bionanocomposites based on cellulose nanofibers or nanocrystals and their preparation/manufacturing processes. It also provides information on different characterization methods and the most important properties of bionanocomposites, as well as techniques of modeling the mechanical properties of nanocomposites. This volume presents the industrial point of view regarding large scale manufacturing and their applications from the perspective of their medical uses in printed electronics and in adhesives.The third volume deals with the ability of bionanomaterials to self-assemble in either liquids or forming organized solid materials. The chemistry of cellulose nanomaterials and chemical modifications as well as different assembling techniques and used characterization methods, and the most important properties which can be achieved by self-assembly, are described. The chapters, for example, discuss subjects such as ultra-light biobased aerogels based on cellulose and chitin, thin films suitable as barrier layers, self-sensing nanomaterials, and membranes for water purification.The fourth volume reviews green composite materials — including green raw materials — such as biobased carbon fibers, regenerated cellulose fibers and thermoplastic and thermoset polymers (e.g. PLA, bio-based polyolefines, polysaccharide polymers, natural rubber, bio-based polyurethane, lignin polymer, and furfurylalchohol). The most important composite processing technologies are described, including: prepregs of green composites, compounding, liquid composite molding, foaming, and compression molding. Industrial applications, especially for green transportation and the electronics industry, are also described.This four-volume set is a must-have for anyone keen to acquire knowledge on novel bionanomaterials — including structure-property correlations, isolation and purification processes of nanofibers and nanocrystals, their important characteristics, processing technologies, industrial up-scaling and suitable industry applications. The handbook is a useful reference not only for teaching activities but also for researchers who are working in this field.

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Genre : Science
Author : Kristiina Oksman
Publisher : World Scientific
Release : 2014-04-11
File : 1124 Pages
ISBN-13 : 9789814566476


Thin Film Materials Processes And Reliability

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Genre : Technology & Engineering
Author : G. S. Mathad
Publisher : The Electrochemical Society
Release : 2003
File : 438 Pages
ISBN-13 : 1566773938