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BOOK EXCERPT:
Product Details :
Genre |
: Technology & Engineering |
Author |
: Ravi Jain |
Publisher |
: |
Release |
: 1987 |
File |
: 378 Pages |
ISBN-13 |
: UOM:39015013829281 |
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BOOK EXCERPT:
Product Details :
Genre |
: Power resources |
Author |
: |
Publisher |
: |
Release |
: 1990 |
File |
: 840 Pages |
ISBN-13 |
: MSU:31293010869141 |
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BOOK EXCERPT:
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Product Details :
Genre |
: Technology & Engineering |
Author |
: |
Publisher |
: ASM International |
Release |
: 2001-01-01 |
File |
: 162 Pages |
ISBN-13 |
: 9780871707451 |
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BOOK EXCERPT:
Product Details :
Genre |
: Physics |
Author |
: |
Publisher |
: |
Release |
: 1992 |
File |
: 812 Pages |
ISBN-13 |
: UOM:39015027735979 |
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BOOK EXCERPT:
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Product Details :
Genre |
: Technology & Engineering |
Author |
: Ashok K. Goel |
Publisher |
: John Wiley & Sons |
Release |
: 2007-10-19 |
File |
: 433 Pages |
ISBN-13 |
: 9780470165966 |
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BOOK EXCERPT:
Semiconductors and Semimetals
Product Details :
Genre |
: Technology & Engineering |
Author |
: |
Publisher |
: Academic Press |
Release |
: 1990-04-25 |
File |
: 455 Pages |
ISBN-13 |
: 9780080864259 |
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BOOK EXCERPT:
Product Details :
Genre |
: Computer engineering |
Author |
: |
Publisher |
: |
Release |
: 1997 |
File |
: 654 Pages |
ISBN-13 |
: PSU:000051701567 |
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BOOK EXCERPT:
This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test.
Product Details :
Genre |
: Technology & Engineering |
Author |
: Selahattin Sayil |
Publisher |
: Springer |
Release |
: 2017-11-16 |
File |
: 92 Pages |
ISBN-13 |
: 9783319696737 |
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BOOK EXCERPT:
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Product Details :
Genre |
: Technology & Engineering |
Author |
: |
Publisher |
: ASM International |
Release |
: 2004-01-01 |
File |
: 813 Pages |
ISBN-13 |
: 9780871708045 |
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BOOK EXCERPT:
Product Details :
Genre |
: Aeronautics |
Author |
: |
Publisher |
: |
Release |
: 1995 |
File |
: 702 Pages |
ISBN-13 |
: UIUC:30112048646605 |