This book provides an overview of emerging semiconductor devices and their applications in electronic circuits, which form the foundation of electronic devices. Device Circuit Co-Design Issues in FETs provides readers with a better understanding of the ever-growing field of low-power electronic devices and their applications in the wireless, biosensing, and circuit domains. The book brings researchers and engineers from various disciplines of the VLSI domain together to tackle the emerging challenges in the field of engineering and applications of advanced low-power devices in an effort to improve the performance of these technologies. The chapters examine the challenges and scope of FinFET device circuits, 3D FETs, and advanced FET for circuit applications. The book also discusses low-power memory design, neuromorphic computing, and issues related to thermal reliability. The authors provide a good understanding of device physics and circuits, and discuss transistors based on the new channel/dielectric materials and device architectures to achieve low-power dissipation and ultra-high switching speeds to fulfill the requirements of the semiconductor industry. This book is intended for students, researchers, and professionals in the field of semiconductor devices and nanodevices, as well as those working on device-circuit co-design issues.

This book offers a comprehensive overview of design and analysis of microwave devices and circuits for 5G and beyond wireless communication systems. It focuses on modern microwave antennas, filters, metamaterials, and MIMO systems. It includes a design approach based on Artificial Intelligence and the practical use of microwave devices and circuits in commercial, medical, and military applications. Microwave Devices and Circuits for Advanced Wireless Communications: Design and Analysis explores the performance of microwave devices and circuits by highlighting the difficulties encountered by researchers and designers such as latency, interoperability, wireless coexistence, data streaming, safety, security, and privacy. The book explores the most important aspects of antenna design, including radiation pattern control, impedance matching with bandwidth improvement, and gain enhancement. It also examines different categories of metasurfaces, including frequency-selective surfaces (FSS) and electromagnetic bandgap (EBG) structures, and their distinct roles in antenna design. Additionally, the book examines concepts such as ultra-wideband (UWB) radar for 5G millimeter wave applications, and advanced techniques such as synthetic aperture radar (SAR), beam-forming, compressed sensing, and diffraction tomography for enabling high-resolution imaging across wider application areas. The authors also present an overview on applying machine learning (ML) techniques to advanced wireless communication for signal-processing tasks such as signal denoising, equalization, and modulation recognition. They then discuss the potential significance of UAV communication systems in achieving seamless connection, quality of service (QoS), as well as the difficulties and potential remedies involved in building dependable networks using UAVs. Throughout the book the authors offer a critical assessment of the strengths and limitations of each topic and approach presented, thus providing valuable guidance for future research in this exciting field. This book will be helpful for graduate students, researchers, and engineers working in the area of design and reliability of circuits for microwave and communication systems.

5G and Beyond Wireless Networks: Technology, Network Deployments, and Materials for Antenna Design offers a comprehensive overview of 5G and beyond 5G wireless networks along with emerging technologies that support the design and development of wireless networks. It also includes discussions on various materials used for practical antenna design which are suitable for 5G, beyond 5G applications, and cell-free massive MIMO systems. The book discusses the latest techniques used in 5G and beyond 5G (B5G) communication, such as non-orthogonal multiple access (NOMA), device-to-device (D2D) communication, 6G ultra-dense O-RAN, rate-splitting multiple access (RSMA), simultaneous wireless information and power transfer (SWIPT), massive multiple input multiple output (mMIMO), and cell-free massive MIMO systems, which are explained in detail for 5G and beyond cellular networks. The description of NOMA and their benefit for 5G and beyond networks is also addressed along with D2D communication for next generation cellular networks. RSMA technique is also explained for 6G communication. Detailed descriptions for the design and development of 5G and beyond networks over various techniques are included. The materials specification to design antenna for 5G application are also given. The role of metalens in designing effective antennas and material specifications for 5G applications is explained in this book. Apart from the above emerging topics, this book also gives ideas about intelligent communication, Internet of Multimedia Things (IOMT), millimeter-wave MIMO-UFMC, and fog computing cloud networks. The last chapter gives details about the legal frameworks for 5G technology for responsible and sustainable deployment. Overall, this book may benefit network design engineers and researchers working in the area of next generation cellular networks. The contents of this book will be helpful for young researchers and master students, and network design engineers who are working in the area of next generation cellular networks.

This book introduces the emerging areas of laser-based manufacturing such as additive manufacturing (AM) of metal matrix composites (MMCs), joining of hard-to-weld superalloys, damage-free machining of fiber-reinforced composites, surface properties enhancement using cladding techniques, and modeling and simulation of laser beam manufacturing techniques. Laser Applications in Manufacturing provides a quick guide for researchers and academicians to recent advancements in the development of powder-based MMCs manufactured using AM technology. This book: shows recent developments in functionally graded sheets or laminates and fabrication of fiber-reinforced composite using sheet lamination printing lists recent developments in the joining of dissimilar materials in diverse applications such as hybrid structures and lightweight components for increased performance and functionality includes many recent developments in machining carbon fiber, glass fiber, and natural fiber composite laminates for investigations of delamination and surface quality characteristics showcases different aspects of surface alloying of miniature components, hard and soft composite coating for various applications. Laser Applications in Manufacturing is recommended for researchers working on fabrication of numerous new and novel materials. The book serves as a resource for scientists and engineers working in laser-based manufacturing techniques who want to learn about the most up-to-date research.

This book provides a thorough introduction of 5G and B5G wireless networks, as well as cutting-edge technologies that aid in network design and development. This book also covers machine learning techniques for advanced communications. 5G and Beyond Wireless Communications: Fundamentals, Applications, and Challenges discusses the newest technologies for 5G and future networks, including CR networks, D2D networks, UAV-assisted communications, RIS-assisted communications, and ML for communication networks. Additionally, it discusses using antenna systems for advanced communications networks. It also explores various security issues and their solutions, as well as power and interference management and machine learning for optimization of network parameters. The book also examines the design of 5G antennas from a materials perspective, and a thorough analysis of the materials utilized to create innovative antennas for advanced communication network is discussed. The book concludes by discussing the advancement of ML-based communication networks and their future opportunities and challenges. This book will be helpful for researchers and master students who want to focus their research work in the area of next-generation advanced wireless communications.

Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.

Human–Machine Interface Technology Advancements and Applications focuses on analysis, design, and evaluation perspectives in HMI technological breakthroughs and applications. It covers a wide range of ideas, methodologies, approaches, and instruments to give the reader a thorough understanding of the field's current academic and industry practice and debate. Physical, cognitive, social, and emotional factors are all considered in the work, which is exemplified by key application fields such as aerospace, automobile, medicine, and defense. This book covers AI and machine learning methodologies as well as biological signals and HMI applications. Nanotechnology, user interface design, and interactive systems are also featured. The MATLAB approach to signal processing applications is also included. This book discusses advances in the field of human–machine interfaces and provides practical knowledge in biomedical signal processing, AI, and machine learning. It discusses augmented reality/virtual reality-based HMI applications. It examines advances in nanotechnology, user interface design, and interactive systems. This book is intended to serve as a research guide that will both inform readers about the fundamentals of HMI from academic and industrial perspectives and provide a glimpse into how human-centered designers, such as engineers and human factors specialists, will attempt to design and develop human–machine systems in the future.

A self-contained and up-to-date account of the current developments in the physics and technology of nanowire semiconductor devices.

Fundamentals of III-V Semiconductor MOSFETs presents the fundamentals and current status of research of compound semiconductor metal-oxide-semiconductor field-effect transistors (MOSFETs) that are envisioned as a future replacement of silicon in digital circuits. The material covered begins with a review of specific properties of III-V semiconductors and available technologies making them attractive to MOSFET technology, such as band-engineered heterostructures, effect of strain, nanoscale control during epitaxial growth. Due to the lack of thermodynamically stable native oxides on III-V's (such as SiO2 on Si), high-k oxides are the natural choice of dielectrics for III-V MOSFETs. The key challenge of the III-V MOSFET technology is a high-quality, thermodynamically stable gate dielectric that passivates the interface states, similar to SiO2 on Si. Several chapters give a detailed description of materials science and electronic behavior of various dielectrics and related interfaces, as well as physics of fabricated devices and MOSFET fabrication technologies. Topics also include recent progress and understanding of various materials systems; specific issues for electrical measurement of gate stacks and FETs with low and wide bandgap channels and high interface trap density; possible paths of integration of different semiconductor materials on Si platform.

"This book will provide an overview of emerging semiconductor devices and their applications in electronic circuits design, which form the foundation of electronic devices. Device Circuit Co-design Issues in FETs provides readers with a better understanding of the ever-growing field of low-power electronic devices and their applications in the wireless, biosensing, and circuit domains. The book brings researchers and engineers from various disciplines of the VLSI domain together to tackle the emerging challenges in the field of engineering and applications of advanced low-power devices in an effort to improve the performance of these technologies. The chapters examine the challenges and scope of FinFET device circuits, 3D FETs and advanced FET for circuit applications. The book also discusses low power memory design, neuromorphic computing, and issues related to thermal reliability. The authors provide a good understanding of device physics and circuits, and discuss transistors based on the new channel/dielectric materials, and device architectures to achieve low-power dissipation and ultra-high switching speeds to fulfill the requirement of the semiconductor industry. This book is intended for students, researchers and professionals in the field of semiconductor devices and nanodevices, as well as those working on device-circuit co-design issues"--