Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle. The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers. With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.

Environmentally safe engineering is one of the hottest and most controversial topics in technical circles. Though many publications offer theory and intellectual discussion of the topic, this book provides practical, hands-on advice including hints and tips from the nation's top engineers. Green Electronics/Green Bottom Line offers practical advice for engineers and managers who want or need to incorporate environmental issues into the design process. The emerging discipline of Design for the Environment (DfE) combines engineering know-how with environmental awareness. Topics include international policy issues such as ISO 14000, materials selection (e.g., for recyclability), manufacturing concerns like no-flux processes, and design issues such as power consumption. Real-world cases show how these elements can be included in everyday designs. Each chapter opens with a topical cartoon and lively story, interview or editorial. The discussion will then move to specific engineering issues and their economic and social context. The last section explores larger possibilities and new directions still to be explored by engineers concerned with education, health, and environmental quality. Contributors include engineers from Motorola, Analog Devices, Dupont, Compaq, Nortel, AMD, and Apple Computer, and academics from universities in the US, Canada, the UK, and Europe, as well as the Rocky Mountain Institute. - An everyday guide to environmentally sound electronics design - Contributors include top engineers from the biggest electronics manufacturers and most prestigious universities - Real-world cases illustrate topics giving concepts the reader can apply immediately

Designing new products and improving existing ones is a continual process. Industrial design engineering is an industrial engineering process applied to product designs that are to be manufactured through techniques of production operations. Excellent industrial design engineering programs are essential for the nation’s industry to succeed in selling useful and ecologically justifiable and usable products on a market flooded with goods and services. This unique text on industrial design engineering integrates basic knowledge, insight, and working methods from industrial engineering and product design subjects. Industrial Design Engineering: Inventive Problem Solving provides a combination of engineering thinking and design skills that give the researchers, practitioners, and students an excellent foundation for participation in product development projects and techniques for establishing and managing such projects. The design principles are presented around examples related to the designing of products, goods, and services. Case studies are developed around real problems and are based on the customer’s needs.

The manufacturing industry is a cornerstone of national economy and people’s livelihood. It is the way of transforming resources into products or goods which are required to cater to the needs of the society. Traditional manufacturing companies currently face several challenges such as rapid technological changes, inventory problem, shortened innovation, short product life cycles, volatile demand, low prices, highly customized products, and ability to compete in the global markets. Modern manufacturing is highly competitive due to globalization and fast changes in the global market. This book reviews emerging technologies in manufacturing. These technologies include artificial intelligence, smart manufacturing, lean manufacturing, robotics, automation, 3D printing, nanotechnology, industrial Internet of things, and augmented reality. The use of these technologies will have a profound impact on the manufacturing industry. The book consists of 19 chapters. Each chapter addresses a single emerging technology in depth and describes how manufacturing organizations are adopting the technology. The book fills an important niche for manufacturing. It is a comprehensive, jargon-free introductory text on the issues, ideas, theories, and problems on emerging technologies in manufacturing. It is a must-read book for beginners or anyone who wants to be updated about emerging technologies.

This textbook provides the tools, techniques, and industry examples needed for the successful implementation of design of experiments (DoE) in engineering and manufacturing applications. It contains a high-level engineering analysis of key issues in the design, development, and successful analysis of industrial DoE, focusing on the design aspect of the experiment and then on interpreting the results. Statistical analysis is shown without formula derivation, and readers are directed as to the meaning of each term in the statistical analysis. Industrial Design of Experiments: A Case Study Approach for Design and Process Optimization is designed for graduate-level DoE, engineering design, and general statistical courses, as well as professional education and certification classes. Practicing engineers and managers working in multidisciplinary product development will find it to be an invaluable reference that provides all the information needed to accomplish a successful DoE. Presents classical versus Taguchi DoE methodologies as well as techniques developed by the author for successful DoE; Offers a step-wise approach to DoE optimization and interpretation of results; Includes industrial case studies, worked examples and detailed solutions to problems.

The second volume of the Wiley series, Environmentally Conscious Manufacturing focuses on environmentally preferable approaches to manufacturing. Contributors present and discuss the technologies engineers need to specify and employ to make manufacturing operations environmentally friendly and conform to environmental regulations. Chapters cover Hazardous Waste Minimization and Management; Cost-Effective Manufacturing; Real-time Process Monitoring and Control; Ethics in ECM; Governmental Regulations and Policies, and Total Quality Management. In each chapter case studies are provided to guide readers in areas outside their expertise.

Responsible Manufacturing has become an obligation to the environment and to society itself, enforced primarily by customer perspective and governmental regulations on environmental issues. This is mainly driven by the escalating deterioration of the environment, such as diminishing raw material resources, overflowing waste sites, and increasing levels of pollution. Responsible Manufacturing related issues have found a large following in industry and academia, which aim to find solutions to the problems that arise in this newly emerged research area. Problems are widespread, including the ones related to the lifecycle of products, disassembly, material recovery, remanufacturing, and pollution prevention. Organized into sixteen chapters, this book provides a foundation for academicians and practitioners, and addresses several important issues faced by strategic, tactical, and operation planners of Responsible Manufacturing. Using efficient models in a variety of decision-making situations, it provides easy-to-use mathematical and/or simulation modeling-based solution methodologies for the majority of the issues. Features Addresses a variety of state-of-the-art issues in Responsible Manufacturing Highlights how popular industrial engineering and operations research techniques can be effectively exploited to find the most effective solutions to problems Presents how a specific issue can be approached or modeled in a given decision-making situation Covers strategic, tactical, and operational systems issues Provides a foundation for academicians and practitioners interested in building bodies of knowledge in this new and fast-growing area

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives