The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

With the encroachment of the Internet into nearly all aspects of work and life, it seems as though information is everywhere. However, there is information and then there is correct, appropriate, and timely information. While we might love being able to turn to Wikipedia for encyclopedia-like information or search Google for the thousands of links

This textbook seeks to bring readers with no prior knowledge or experience in interfacial phenomena, colloid science or nanoscience to the point where they can comfortably enter the current scientific and technical literature in the area.Designed as a pedagogical tool, this textbook recognizes the cross-disciplinary nature of the subject. To facilitate learning, the topics are developed from the beginning with ample cross-referencing. The understanding of concepts is enhanced by clear descriptions of experiments and provisions of figures and illustrations.

This edited book focuses on the latest advances and development of utilizing two-dimensional nanostructures for energy and its related applications. Traditionally, the geometry of this material refers to "thin film" or "coating." The book covers three main parts, beginning with synthesis, processing, and property of two-dimensional nanostructures for active and passive layers followed by topics on characterization of the materials. It concludes with topics relating to utilization of the materials for usage in devises for energy and its related applications.

Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

This book provides a survey of the latest research and developments in plasma technology. In an easy and comprehensive manner, it explores what plasma is and the technologies utilized to produce plasma. It then investigates the main applications and their benefits. Different from other books on the topic that focus on specific aspects of plasma technology, the intention is to provide an introduction to all aspects related to plasma technologies. This book will be an ideal resource for graduate students studying plasma technologies, in addition to researchers in physics, engineering, and materials science Features Accessible and easy to understand Provides simple yet exhaustive explanations of the foundations Explores the latest technologies and is filled with practical applications and case studies

The book Thin Film Processes - Artifacts on Surface Phenomena and Technological Facets presents topics on global advancements in theoretical and experimental facts, instrumentation and practical applications of thin-film material perspectives and its applications. The aspect of this book is associated with the thin-film physics, the methods of deposition, optimization parameters and its wide technological applications. This book is divided into three main sections: Thin Film Deposition Methods: A Synthesis Perspective; Optimization Parameters in the Thin Film Science and Application of Thin Films: A Synergistic Outlook. Collected chapters provide applicable knowledge for a wide range of readers: common men, students and researchers. It was constructed by experts in diverse fields of thin-film science and technology from over 15 research institutes across the globe.