Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.

The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.

High-Temperature Phase Change Materials for Thermal Energy Storage covers the fundamentals, thermal characteristics, measurement, design, and applications of high-temperature phase change materials (PCMs) for thermal energy storage, supported by examples and numerical modeling. The differences between low-temperature and high-temperature PCMs are examined with respect to thermophysical properties, phase change properties, and melting/solidification processes, with detailed coverage of how to alter or shorten the phase transition temperature range between melting and solidification, providing routes for the utilization of PCMs for specific high-temperature applications. The book also addresses key challenges, such as the design of PCM containers, phase transition temperature with little deviation, high latent heat capacity, thermal conductivity, viscosity, efficiency, ecocompatibility, and cost. This book is a valuable resource for researchers, advanced students, and scientists across the areas of energy storage, power generation, energy engineering, thermodynamics, materials science, renewable energy, energy management, mechanical engineering, and chemical engineering as well as engineers, research and development professionals, and other industry personnel with an interest in thermal energy storage design and materials. - Focuses on high-temperature PCMs for thermal energy storage, with real-life applications - Provides detailed information on fundamentals, thermal characteristics, measurement, and design - Addresses key challenges and includes examples, numerical studies, and modeling

High-Temperature Thermal Storage Systems Using Phase Change Materials offers an overview of several high-temperature phase change material (PCM) thermal storage systems concepts, developed by several well-known global institutions with increasing interest in high temperature PCM applications such as solar cooling, waste heat and concentrated solar power (CSP). The book is uniquely arranged by concepts rather than categories, and includes advanced topics such as thermal storage material packaging, arrangement of flow bed, analysis of flow and heat transfer in the flow bed, energy storage analysis, storage volume sizing and applications in different temperature ranges. By comparing the varying approaches and results of different research centers and offering state-of-the-art concepts, the authors share new and advanced knowledge from researchers all over the world. This reference will be useful for researchers and academia interested in the concepts and applications and different techniques involved in high temperature PCM thermal storage systems. - Offers coverage of several high temperature PCM thermal storage systems concepts developed by several leading research institutions - Provides new and advanced knowledge from researchers all over the world - Includes a base of material properties throughout

It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.

The book provides an overview of III-nitride-material-based light-emitting diode (LED) technology, from the basic material physics to the latest advances in the field, such as homoepitaxy and heteroepitaxy of the materials on different substrates. It also includes the latest advances in the field, such as approaches to improve quantum efficiency and reliability as well as novel structured LEDs. It explores the concept of material growth, chip structure, packaging, reliability and application of LEDs. With spectra coverage from ultraviolet (UV) to entire visible light wavelength, the III-nitride-material-based LEDs have a broad application potential, and are not just limited to illumination. These novel applications, such as health & medical, visible light communications, fishery and horticulture, are also discussed in the book.

Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. - Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods - Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies - Touches on emerging, real-world applications for thermal management strategies in power electronics

A thermal conductivity apparatus employing the absolute guarded hot plate principle was designed developed and fabricated for the United States Air Force. The primary objective of this instrument is to test honeycomb structures at elevated temperatures. A secondary objective is to test super-alloys, ceramics, and cermets. In general these operational requirements were met with calibration runs on copper to 1800 F and Al2O3 to 3000 F falling within the prescribed accuracy limits. Further thermal conductivity tests have been completed on Rene' 41 Honeycomb, Titanium Alloy Honeycomb, L605 Cobalt Alloy Honeycomb, Stainless Stainless Steel, Rene' 41, and Fused Silica. Thermal conductance tests on Tungsten and Columbium are planned. A detailed discussion is made of instrumentation and materials compatability problems encountered during the testing program.