Collects 58 papers from the April/May 2001 symposium that explore new approaches in the testing of electronic circuits and systems. Key areas in testing are discussed, such as BIST, analog measurement, fault tolerance, diagnosis methods, scan chain design, memory test and diagnosis, and test data compression and compaction. Also on the program are sessions on emerging areas that are gaining prominence, including low power testing, testing high speed circuits on low cost testers, processor based self test techniques, and core- based system-on-chip testing. Some of the topics are robust and low cost BIST architectures for sequential fault testing in datapath multipliers, a method for measuring the cycle-to-cycle period jitter of high-frequency clock signals, fault equivalence identification using redundancy information and static and dynamic extraction, and test scheduling for minimal energy consumption under power constraints. No subject index. c. Book News Inc.

Proceedings of a spring 2000 symposium, highlighting novel ideas and approaches to current and future problems related to testing of electronic circuits and systems. Themes are microprocessor test/validation, low power BIST and scan, technology trends, scan- related approaches, defect-driven techniques, and system-on-chip test techniques. Other subjects are analog test techniques, temperature and process drift issues, test compaction and design validation, analog BIST, and functional test and verification issues. Also covered are STIL extension, IDDQ test, and on-line testing and fault tolerance. Lacks a subject index. Annotation copyrighted by Book News, Inc., Portland, OR.

The theme of the April 1999 symposium Scaling deeper to submicron: test technology challenges reflects the issues being created by the move toward nanometer technologies. Many creative and novel ideas and approaches to the current and future electronic circuit testing-related problems are explored

VLSI 2010 Annual Symposium will present extended versions of the best papers presented in ISVLSI 2010 conference. The areas covered by the papers will include among others: Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field-programmable and Reconfigurable Systems, System Level Design, System-on-a-Chip Design, Application-Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed-Signal Design and Analysis, Electrical/Packaging Co-Design, Physical Design, Intellectual property creating and sharing.

The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.

This book constitutes the refereed proceedings of the First International Conference on Ubiquitous Communications and Network Computing, UBICNET 2017, held in Bangalore, India, in August 2017. The 23 full papers were selected from 71 submissions and are grouped in topical sections on safety and energy efficient computing, cloud computing and mobile commerce, advanced and software defined networks, and advanced communication systems and networks.

This book constitutes the refereed proceedings of the 17th International Symposium on VLSI Design and Test, VDAT 2013, held in Jaipur, India, in July 2013. The 44 papers presented were carefully reviewed and selected from 162 submissions. The papers discuss the frontiers of design and test of VLSI components, circuits and systems. They are organized in topical sections on VLSI design, testing and verification, embedded systems, emerging technology.

The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.