Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."

Here is a comprehensive practical guide to entire wafer fabrication process from A to Z. Written by a practicing process engineer with years of experience, this book provides a thorough introduction to the complex field of IC manufacturing, including wafer area layout and design, yield optimization, just-in-time management systems, statistical quality control, fabrication equipment and its setup, and cleanroom techniques. In addition, it contains a wealth of information on common process problems: How to detect them, how to confirm them, and how to solve them. Whether you are a new enginner or technician just entering the field, a fabrication manager looking for ways to improve quality and production, or someone who would just like to know more about IC manufacturing, this is the book you're looking for. - Provides a readable, practical overview of the entire wafer fabrication process for new engineers and those just entering this complex field - Enables engineers and managers to improve production, raise quality levels, and solve problems that commonly occur in the fabrication process - Presents the latest techniques and gives special attention to Japanese IC manufacturing techniques, showing how they obtain outstanding quality

High reliability, maintanability, and safety are expected fro complex equipment and systems. This book presents state-of-the-art methods and procedures used for cost and time effective quality and reliability assurance during the design and production of equipment and systems. It is based on more than 20 years experience gained by the author in research and industry. The book covers theory, practice, and management aspects and addresses the needs of scientists, system-oriented engineers, engineers in development and production and project and quality assurance managers. The second edition has been completely updated revised and includes modern concepts such as Total Quality Management (TQM) and Concurrent Engineering.

This assessment continues the Office of Technology Assessment's (OTA) exploration of the meaning of industrial policy in the United States context, while also examining the industrial policies of several U.S. economic rivals. The major focus is on electronics, an area which virtually defines "high technology" of the 1980's. The assessment sets the characteristics of the technology itself alongside other forces that exert major influences over international competitiveness. Specific areas addressed include: electronics technology; structure, trade, and competitiveness in the international electronics industry; quality, reliability, and automation in manufacturing; role of financing in competitiveness and electronics; human resources (education, training, management); employment effects; national industrial policies; and U.S. trade policies and their effects. The report concludes by outlining five options for a U.S. industrial policy, drawing on electronics for examples of past and prospective impacts, as well as on OTA's previous studies of the steel and automotive industries. A detailed summary and introductory comments are included. Also included in appendices are case studies in the development and marketing of electronics products, a discussion of offshore manufacturing, and a glossary of terms used in the assessment. (JN)

This book walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process. It covers all CAD/CAE aspects of a SOC design flow and addresses a new topic (DFM/DFY) critical at 90 nm and beyond. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.