This unique new book is your single resource for all issues related to intermodulation and multi-tone distortion in microwave and wireless circuits. Beginning with an overview of the general concepts of distortion in microwave and wireless devices, it delves into the theory and practical aspects of nonlinear distortion, tools for nonlinear analysis, mathematical representations of wireless circuits and devices, and design methods for minimizing distortion.

In today's fast-changing, competitive environment, having an up-to-date information system (IS) is critical for all companies and institutions. Rather than creating a new system from scratch, reengineering is an economical way to develop an IS to match changing business needs. Using detailed examples, this practical book gives you methods and techniques for reengineering systems for flexibility and reliability. It helps you reengineer a system to continue to provide for business critical missions as well as achieve a smooth transformation to an up-to-date software technology environment. What's more, it shows you how to redevelop a flexible system that can evolve to meet future business objectives, reduce start time and save money in the reengineering process.

To design and develop fast and effective microwave wireless systems today involves addressing the three different 'levels': Device, circuit, and system. This book presents the links and interactions between the three different levels rather than providing just a comprehensive coverage of one specific level. With the aim of overcoming the sectional knowledge of microwave engineers, this will be the first book focused on explaining how the three different levels interact by taking the reader on a journey through the different levels going from the theoretical background to the practical applications. - Explains the links and interactions between the three different design levels of wireless communication transmitters: device, circuit, and system - Presents state-of-the-art, challenges, and future trends in the field of wireless communication systems - Covers all aspects of both mature and cutting-edge technologies for semiconductor devices for wireless communication applications - Many circuit designs outlining the limitations derived from the available transistor technologies and system requirements - Explains how new microwave measurement techniques can represent an essential tool for microwave modellers and designers

This book is intended to provide a step-by-step guide to all design aspects and tradeoffs from theory to application for fiber-optics transceiver electronics. Presenting a compendium of information in a structured way, this book enables the engineer to develop a methodical design approach, a deep understanding of specifications parameters and the reasons behind them, as well as their effects and consequences on system performance, which are essential for proper component design. Further, a fundamental understanding of RF, digital circuit design, and linear and nonlinear phenomena is important in order to achieve the desired performance levels. Becoming familiar with solid-state devices and passives used to build optical receivers and transmitters is also important so one can effectively overcome design limitations.

Technological advances have created a need for the merger and rethinking of past testing approaches for wireless equipment. This first-of-its-kind resource offers professionals an in-depth overview of cutting-edge RF (radio frequency) and SOC (system on a chip) product testing for wireless communications.

Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students. Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly. In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.

Four leaders in the field of microwave circuit design share their newest insights into the latest aspects of the technology The third edition of Microwave Circuit Design Using Linear and Nonlinear Techniques delivers an insightful and complete analysis of microwave circuit design, from their intrinsic and circuit properties to circuit design techniques for maximizing performance in communication and radar systems. This new edition retains what remains relevant from previous editions of this celebrated book and adds brand-new content on CMOS technology, GaN, SiC, frequency range, and feedback power amplifiers in the millimeter range region. The third edition contains over 200 pages of new material. The distinguished engineers, academics, and authors emphasize the commercial applications in telecommunications and cover all aspects of transistor technology. Software tools for design and microwave circuits are included as an accompaniment to the book. In addition to information about small and large-signal amplifier design and power amplifier design, readers will benefit from the book's treatment of a wide variety of topics, like: An in-depth discussion of the foundations of RF and microwave systems, including Maxwell's equations, applications of the technology, analog and digital requirements, and elementary definitions A treatment of lumped and distributed elements, including a discussion of the parasitic effects on lumped elements Descriptions of active devices, including diodes, microwave transistors, heterojunction bipolar transistors, and microwave FET Two-port networks, including S-Parameters from SPICE analysis and the derivation of transducer power gain Perfect for microwave integrated circuit designers, the third edition of Microwave Circuit Design Using Linear and Nonlinear Techniques also has a place on the bookshelves of electrical engineering researchers and graduate students. It's comprehensive take on all aspects of transistors by world-renowned experts in the field places this book at the vanguard of microwave circuit design research.

Summarizes cutting-edge physical layer technologies for multi-mode wireless RF transceivers. Includes original contributions from distinguished researchers and professionals. Covers cutting-edge physical layer technologies for multi-mode wireless RF transceivers. Contributors are all leading researchers and professionals in this field.

This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.