The field of flexible electronics has grown rapidly over the last two decades with diverse applications including wearable gadgets and medical equipment. This textbook comprehensively covers the fundamental aspects of flexible electronics along with materials and processing techniques. It discusses topics including flexural rigidity, flexible PCBs, organic semiconductors, nanostructured materials, material reliability, electronic reliability, crystalline and polymer materials, semiconductor processing, and flexible silicon in depth. The text covers advantages, disadvantages, and applications of processes such as sol-gel processing and ink-jet printing. Pedagogical features such as solved problems and unsolved exercises are interspersed throughout the text for better understanding. FEATURES Covers major areas such as materials, physics, processes, and applications of flexible electronics Contains homework problems for readers to understand concepts in an easy manner Discusses, in detail, various types of materials, such as flexible silicon, metal oxides, and organic semiconductors Explains the application of flexible electronics in displays, solar cells, and batteries Includes a section on stretchable electronics This textbook is primarily written for senior undergraduate and graduate students in electrical engineering, electronics, materials science, chemistry, and communication engineering for a course on flexible electronics. Teaching resources are available, including a solutions manual for instructors.

This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.

Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.

Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

From materials to applications, this ready reference covers the entire value chain from fundamentals via processing right up to devices, presenting different approaches to large-area electronics, thus enabling readers to compare materials, properties and performance. Divided into two parts, the first focuses on the materials used for the electronic functionality, covering organic and inorganic semiconductors, including vacuum and solution-processed metal-oxide semiconductors, nanomembranes and nanocrystals, as well as conductors and insulators. The second part reviews the devices and applications of large-area electronics, including flexible and ultra-high-resolution displays, light-emitting transistors, organic and inorganic photovoltaics, large-area imagers and sensors, non-volatile memories and radio-frequency identification tags. With its academic and industrial viewpoints, this volume provides in-depth knowledge for experienced researchers while also serving as a first-stop resource for those entering the field.

Organic Electronics is a novel field of electronics that has gained an incredible attention over the past few decades. New materials, device architectures and applications have been continuously introduced by the academic and also industrial communities, and novel topics have raised strong interest in such communities, as molecular doping, thermoelectrics, bioelectronics and many others.Organic Flexible Electronics is mainly divided into three sections. The first part is focused on the fundamentals of organic electronics, such as charge transport models in these systems and new approaches for the design and synthesis of novel molecules. The first section addresses the main challenges that are still open in this field, including the important role of interfaces for achieving high-performing devices or the novel approaches employed for improving reliability issues.The second part discusses the most innovative devices which have been developed in recent years, such as devices for energy harvesting, flexible batteries, high frequency circuits, and flexible devices for tattoo electronics and bioelectronics.Finally the book reviews the most important applications moving from more standard flexible back panels to wearable and textile electronics and more futuristic applications like ingestible systems. - Reviews the fundamental properties and methods for optimizing organic electronic materials including chemical doping and techniques to address stability issues - Discusses the most promising organic electronic devices for energy, electronics, and biomedical applications - Addresses key applications of organic electronic devices in imagers, wearable electronics, bioelectronics

This book provides an interesting snapshot of new research within the fields of flexible and soft devices which use porous carbon-based materials. The increase in demand for soft and flexible electronics, electrochemical energy storage/conversion systems, piezoresistive pressure sensors has promoted the development of new strategies for the synthesis and integration of nanoporous carbon (NPC) into flexible and soft polymers and inorganic textures. The structural properties of such NPC materials combined with their mechanical, conductive and catalytic properties, show promising results for the technology they are designed for, which can be useful solutions in many other disciplines. An in-depth discussion of the use of NPC materials in different energy devices is provided in every chapter, while at the same time the knowledge of the reader on the various applications where these materials can be used will be broadened. This book sheds new light on nanoporous carbon-based materials and will be of great interest to graduate students and professionals working in this field.

Flexibility and stretchability of electronics are crucial for next generation electronic devices that involve skin contact sensing and therapeutic actuation. This handbook provides a complete entrée to the field, from solid-state physics to materials chemistry, processing, devices, performance, and reliability testing, and integrated systems development. This work shows how microelectronics, signal processing, and wireless communications in the same circuitry are impacting electronics, healthcare, and energy applications. Key Features: • Covers the fundamentals to device applications, including solid-state and mechanics, chemistry, materials science, characterization techniques, and fabrication; • Offers a comprehensive base of knowledge for moving forward in this field, from foundational research to technology development; • Focuses on processing, characterization, and circuits and systems integration for device applications; • Addresses the basic physical properties and mechanics, as well as the nuts and bolts of reliability and performance analysis; • Discusses various technology applications, from printed electronics to logic and memory devices, sensors, actuators, displays, and energy storage and harvesting. This handbook will serve as the one-stop knowledge base for readership who are interested in flexible and stretchable electronics.

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

This book focuses on carbon nanotubes and graphene as representatives of nano-carbon materials, and describes the growth of new technology and applications of new devices. As new devices and as new materials, nano-carbon materials are expected to be world pioneers that could not have been realized with conventional semiconductor materials, and as those that extend the limits of conventional semiconductor performance. This book introduces the latest achievements of nano-carbon devices, processes, and technology growth. It is anticipated that these studies will also be pioneers in the development of future research of nano-carbon devices and materials. This book consists of 18 chapters. Chapters 1 to 8 describe new device applications and new growth methods of graphene, and Chapters 9 to 18, those of carbon nanotubes. It is expected that by increasing the advantages and overcoming the weak points of nanocarbon materials, a new world that cannot be achieved with conventional materials will be greatly expanded. We strongly hope this book contributes to its development.