This book covers issues and solutions in the physical integration and tapeout management for VLSI design. Chapter 1 gives the overview. Chapter 2 shows detailed techniques for physical design. Chapter 3 provides CAD flows. Chapter 4 discusses on-chip interconnects. A glossary of keywords is provided at the end.

With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding

The book is organized in seven chapters. Physical design flow. Timing constraints. Place and route concepts. Tool vendors. Process constraints. Timing closure. Place and route methodology and flow. ECO and spare gates. Formal verification. Coupling noise. Chip optimization and tapeout.

This book provides a comprehensive overview of the VLSI design process. It covers end-to-end system on chip (SoC) design, including design methodology, the design environment, tools, choice of design components, handoff procedures, and design infrastructure needs. The book also offers critical guidance on the latest UPF-based low power design flow issues for deep submicron SOC designs, which will prepare readers for the challenges of working at the nanotechnology scale. This practical guide will provide engineers who aspire to be VLSI designers with the techniques and tools of the trade, and will also be a valuable professional reference for those already working in VLSI design and verification with a focus on complex SoC designs. A comprehensive practical guide for VLSI designers; Covers end-to-end VLSI SoC design flow; Includes source code, case studies, and application examples.

The aim of proceeding of International Conference on Material Engineering and Mechanical Engineering [MEME2015] is to provide a platform for researchers, engineers, and academicians, as well as industrial professionals, to present their research results and applications developed for Material Engineering and Mechanical Engineering. It provides an opportunities for the delegates to exchange new ideas and application experiences, to enhance business or research relations and to find global partners for future collaboration. The object is to strengthen national academic exchanges and cooperation in the field, promote the rapid development of machinery, materials science and engineering application, effectively improve China's machinery, materials science and engineering applications in the field of academic status and international influence.

This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.

This book shares with readers practical design knowledge gained from the author’s 24 years of IC design experience. The author addresses issues and challenges faced commonly by IC designers, along with solutions and workarounds. Guidelines are described for tackling issues such as clock domain crossing, using lockup latch to cross clock domains during scan shift, implementation of scan chains across power domain, optimization methods to improve timing, how standard cell libraries can aid in synthesis optimization, BKM (best known method) for RTL coding, test compression, memory BIST, usage of signed Verilog for design requiring +ve and -ve calculations, state machine, code coverage and much more. Numerous figures and examples are provided to aid the reader in understanding the issues and their workarounds.

Issues for 2009- cataloged as a serial in LC