This book brings together innovative modelling, simulation and design techniques in CMOS, SOI, GaAs and BJT to achieve successful high-yield manufacture for low-power, high-speed and reliable-by-design analogue and mixed-mode integrated systems.

Very Large Scale Integration (VLSI) Systems refer to the latest development in computer microchips which are created by integrating hundreds of thousands of transistors into one chip. Emerging research in this area has the potential to uncover further applications for VSLI technologies in addition to system advancements. Design and Modeling of Low Power VLSI Systems analyzes various traditional and modern low power techniques for integrated circuit design in addition to the limiting factors of existing techniques and methods for optimization. Through a research-based discussion of the technicalities involved in the VLSI hardware development process cycle, this book is a useful resource for researchers, engineers, and graduate-level students in computer science and engineering.

Low Power Design in Deep Submicron Electronics deals with the different aspects of low power design for deep submicron electronics at all levels of abstraction from system level to circuit level and technology. Its objective is to guide industrial and academic engineers and researchers in the selection of methods, technologies and tools and to provide a baseline for further developments. Furthermore the book has been written to serve as a textbook for postgraduate student courses. In order to achieve both goals, it is structured into different chapters each of which addresses a different phase of the design, a particular level of abstraction, a unique design style or technology. These design-related chapters are amended by motivations in Chapter 2, which presents visions both of future low power applications and technology advancements, and by some advanced case studies in Chapter 9. From the Foreword: `... This global nature of design for low power was well understood by Wolfgang Nebel and Jean Mermet when organizing the NATO workshop which is the origin of the book. They invited the best experts in the field to cover all aspects of low power design. As a result the chapters in this book are covering deep-submicron CMOS digital system design for low power in a systematic way from process technology all the way up to software design and embedded software systems. Low Power Design in Deep Submicron Electronics is an excellent guide for the practicing engineer, the researcher and the student interested in this crucial aspect of actual CMOS design. It contains about a thousand references to all aspects of the recent five years of feverish activity in this exciting aspect of design.' Hugo de Man Professor, K.U. Leuven, Belgium Senior Research Fellow, IMEC, Belgium

With a billion – soon to be two billion - cellular telephones in circulation, the next challenge is to make cellular radio functions adaptive to their environment. This book provides a comprehensive theoretical framework for optimizing performance, discussing joint optimization of Noise Figure and Input Intercept Point in receiver systems. Also examined are original techniques to optimize voltage controlled oscillators and low-noise amplifiers, minimizing power consumption while maintaining adequate system performance.

Motivated by consumer demand for smaller, more portable electronic devices that offer more features and operate for longer on their existing battery packs, cutting edge electronic circuits need to be ever more power efficient. For the circuit designer, this requires an understanding of the latest low voltage and low power (LV/LP) techniques, one of the most promising of which makes use of the floating gate MOS (FGMOS) transistor.

Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition describes the different facets of SOI technology. SOI chips are now commercially available and SOI wafer manufacturers have gone public. SOI has finally made it out of the academic world and is now a big concern for every major semiconductor company. SOI technology has indeed deserved serious recognition: high-temperature (400°C), extremely rad-hard (500 Mrad(Si)), high-density (16 Mb, 0.9-volt DRAM), high-speed (several GHz) and low-voltage (0.5 V) SOI circuits have been demonstrated. Strategic choices in favor of the use of SOI for low-voltage, low-power portable systems have been made by several major semiconductor manufacturers. Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI device processing, the physics of the SOI MOSFET as well as that of SOI other devices, and the performances of SOI circuits are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves as an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition is recommended for use as a textbook for classes on semiconductor device processing and physics. The level of the book is appropriate for teaching at both the undergraduate and graduate levels. Silicon-on-Insulator Technology: Materials to VLSI, 2nd Edition includes the new materials, devices, and circuit concepts which have been devised since the publication of the first edition. The circuit sections, in particular, have been updated to present the performances of SOI devices for low-voltage, low-power applications, as well as for high-temperature, smart-power, and DRAM applications. The other sections, such as those describing SOI materials, the physics of the SOI MOSFET and other devices have been updated to present the state of the art in SOI technology.

There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own

In response to tremendous growth and new technologies in the semiconductor industry, this volume is organized into five, information-rich sections. Digital Design and Fabrication surveys the latest advances in computer architecture and design as well as the technologies used to manufacture and test them. Featuring contributions from leading experts, the book also includes a new section on memory and storage in addition to a new chapter on nonvolatile memory technologies. Developing advanced concepts, this sharply focused book— Describes new technologies that have become driving factors for the electronic industry Includes new information on semiconductor memory circuits, whose development best illustrates the phenomenal progress encountered by the fabrication and technology sector Contains a section dedicated to issues related to system power consumption Describes reliability and testability of computer systems Pinpoints trends and state-of-the-art advances in fabrication and CMOS technologies Describes performance evaluation measures, which are the bottom line from the user’s point of view Discusses design techniques used to create modern computer systems, including high-speed computer arithmetic and high-frequency design, timing and clocking, and PLL and DLL design

Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design. It uses a large number of real examples from industrial design as a vehicle both to teach the principles and to ensure relevance starting from device level modeling to basic RF microelectronic circuit cell design. Modeling for high-frequency operation of both active and passive integrated devices is covered starting from the bipolar transistor to the MOS transistor to the modeling of integrated spiral inductors, resistors, capacitors, varactors and package parasitics structures. A chapter is also devoted to the presentation of the basic definitions and terminology used in RF IC design. The book continues with the presentation of the principal building blocks of an integrated RF front-end, namely, the LNA, the mixer, the VCO and integrated filters. Design paradigms are provided classified on the technology used in each case: pure bipolar, CMOS, BiCMOS or SiGe. Radio-Frequency Microelectronic Circuits for Telecommunication Applications is essential reading for all researchers, practising engineers and designers working in RF electronics. It is also a reference for use in advanced undergraduate or graduate courses in the same field.

Part I: RF System Integration. 1. RF System Integration; C. Toumazou. 2. RF System Board Level Integration for Mobile Phones; G.J. Aspin. 3. Integration of RF Systems on a Chip; P.J. Mole. 4. Towards the Full Integration of Wireless Front-End Circuits; M. Steyaert. 5. GSM Transceiver Front-End Circuits in 0.25 mum CMOS; Q. Huang, et al. Part II: RF Front-End Circuits. 6. RF Front-End Circuits; Q. Huang. 7. Phase-Noise-to-Carrier Ratio in LC Oscillators; Q. Huang. 8. Design Study of a 900 MHz/1.8 GHz CMOS Transceiver for Dual-Band Applications; B. Razavi. 9. Integrated Wireless Transc.