Discover the concepts and techniques needed to design millimeter-wave circuits for current and emerging wireless system applications.

This book tackles the challenges of designing mm-wave circuits in 16nm FinFET, from the elementary transistor level to a measured D-band transmitter. The design of crucial building blocks such as oscillators and power amplifiers are covered through theoretical limitations, design methodology and measurement. Offers first book on design of mm-wave circuits above 100GHz in an advanced 16nm FinFET digital technology; Covers fundamentals of transistor layout, circuit implementation and measurements; Provides single-source reference to information otherwise only available in disparate literature.

RF CIRCUITS FOR 5G APPLICATIONS This book addresses FinFET-based analog IC designing for fifth generation (5G) communication networks and highlights the latest advances, problems, and challenges while presenting the latest research results in the field of mmwave integrated circuits designing. The wireless communication sector is experiencing exponential expansion, particularly in the areas of mobile data and the 5G mobile network, creating fresh market possibilities for designing the integrated circuits (ICs) needed in the industry. Drawing from scientific literature and practical realization, this book explores FinFET-based analog IC designing for 5G communication networks and considers the latest breakthroughs and obstacles. It also presents the recent research trends and future roadmaps for the 5G communication circuits. RF Circuits for 5G Applications includes design guidelines to be considered when designing these circuits and detrimental scaling effects of the same. In addition, to enhance the usability of this book, the editors have included real-time problems in RFIC designing and case studies from experimental results, as well as clearly demarcated design guidelines for the 5G communication ICs designing. Audience The primary target audience includes researchers, postgraduate students, and industry professionals pursuing specializations in RF engineering, electronics engineering, electrical engineering, information, and communication technology.

This book contributes to the body of scholarly knowledge by exploring the main ideas of wireless networks of past, present, and future, trends in the field of networking, the capabilities of 5G and technologies that are potential enablers of 6G, potential 6G applications and requirements, as well as unique challenges and opportunities that 6G research is going to offer over the next decade. It covers research topics such as communication via millimeter-waves, terahertz waves and visible light to enable faster speeds, as well as research into achieving other basic requirements of 6G networks. These include low end-to-end latency, high energy efficiency, coverage that is ubiquitous and always-on, integration of terrestrial wireless with non-terrestrial networks, network management that is made more effective by connected intelligence with machine learning capabilities, as well as support for the evolution of old service classes and support for new ones.

This book examines the critical differences between current and next-generation Si technologies (CMOS, BiCMOS and SiC) and technology platforms (e.g. system-on-chip) in mm-wave wireless applications. We provide a basic overview of the two technologies from a technical standpoint, followed by a review of the state-of-the-art of several key building blocks in wireless systems. The influences of system requirements on the choice of semiconductor technology are vital to understanding the merits of CMOS and BiCMOS devices – e.g., output power, battery life, adjacent channel interference, cost restrictions, and so forth. These requirements, in turn, affect component-level design and performance metrics of oscillators, mixers, power and low-noise amplifiers, as well as phase-locked loops and data converters. Finally, the book offers a peek into the next generation of wireless technologies such as THz -band systems and future 6G applications.

New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. - Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies - Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) - Focuses on mm-wave frequencies up to the terahertz regime

This is the first book to bring together the increasingly complex radar automotive technologies and tools being explored and utilized in the development of fully autonomous vehicles – technologies and tools now understood to be an essential need for the field to fully mature. The book presents state-of-the-art knowledge as shared by the best and brightest experts working in the automotive radar industry today -- leaders who have “been there and done that.” Each chapter is written as a standalone "master class" with the authors, seeing the topic through their eyes and experiences. Where beneficial, the chapters reference one another but can otherwise be read in any order desired, making the book an excellent go-to reference for a particular topic or review you need to understand. You’ll get a big-picture tour of the key radar needs for fully autonomous vehicles, and how achieving these needs is complicated by the automotive environment’s dense scenes, number of possible targets of interest, and mix of very large and very small returns. You’ll then be shown the challenges from – and mitigations to – radio frequency interference (RFI), an ever-increasing challenge as the number of vehicles with radars – and radars per vehicle grow. The book also dives into the impacts of weather on radar performance, providing you with insights gained from extensive real-world testing. You are then taken through the integration and systems considerations, especially regarding safety, computing needs, and testing. Each of these areas is influenced heavily by the needs of fully autonomous vehicles and are open areas of research and development. With this authoritative volume you will understand: * How to engage with radar designers (from a system integrator / OEM standpoint); * How to structure and set requirements for automotive radars; * How to address system safety needs for radars in fully autonomous vehicles; * How to assess weather impact on the radar and its ability to support autonomy; * How to include weather effects into specifications for radars. This is an essential reference for engineers currently in the autonomous vehicle arena and/or working in automotive radar development, as well as engineers and leaders in adjacent radar fields needing to stay abreast of the rapid developments in this exciting and dynamic field of research and development.

Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as “ultra-wide bandgap” materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III–V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: – GaN- and SiC-based devices for power and optoelectronic applications – Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices – AlN-based emerging material and devices – BN epitaxial growth, characterization, and devices

The millimeter-wave frequency band (30–300 GHz) is considered a potential candidate to host very high data rate communications. First used for high capacity radio links and then for broadband indoor wireless networks, the interest in this frequency band has increased as it is proposed to accommodate future 5G mobile communication systems. The large bandwidth available will enable a number of new uses for 5G. In addition, due to the large propagation attenuation, this frequency band may provide some additional advantages regarding frequency reuse and communication security. However, a number of issues have to be addressed to make mm-wave communications viable. This book collects a number of contributions that present solutions to these challenges.

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.