This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication. The book introduces the technological know-how to transform silicon into functional devices, to understand the technology for which a layout is targeted (Chap. 2). Using this core technology knowledge as the foundation, subsequent chapters delve deeper into specific constraints and aspects of physical design, such as interfaces, design rules and libraries (Chap. 3), design flows and models (Chap. 4), design steps (Chap. 5), analog design specifics (Chap. 6), and finally reliability measures (Chap. 7). Besides serving as a textbook for engineering students, this book is a foundational reference for today’s circuit designers. For Slides and Other Information: https://www.ifte.de/books/pd/index.html

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

This book provides broad and comprehensive coverage of the entire EDA flow. EDA/VLSI practitioners and researchers in need of fluency in an "adjacent" field will find this an invaluable reference to the basic EDA concepts, principles, data structures, algorithms, and architectures for the design, verification, and test of VLSI circuits. Anyone who needs to learn the concepts, principles, data structures, algorithms, and architectures of the EDA flow will benefit from this book. - Covers complete spectrum of the EDA flow, from ESL design modeling to logic/test synthesis, verification, physical design, and test - helps EDA newcomers to get "up-and-running" quickly - Includes comprehensive coverage of EDA concepts, principles, data structures, algorithms, and architectures - helps all readers improve their VLSI design competence - Contains latest advancements not yet available in other books, including Test compression, ESL design modeling, large-scale floorplanning, placement, routing, synthesis of clock and power/ground networks - helps readers to design/develop testable chips or products - Includes industry best-practices wherever appropriate in most chapters - helps readers avoid costly mistakes

The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Comprehensive Materials Processing, Thirteen Volume Set provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources

Digital Microfluidic Biochips focuses on the automated design and production of microfluidic-based biochips for large-scale bioassays and safety-critical applications. Bridging areas of electronic design automation with microfluidic biochip research, the authors present a system-level design automation framework that addresses key issues in the design, analysis, and testing of digital microfluidic biochips. The book describes a new generation of microfluidic biochips with more complex designs that offer dynamic reconfigurability, system scalability, system integration, and defect tolerance. Part I describes a unified design methodology that targets design optimization under resource constraints. Part II investigates cost-effective testing techniques for digital microfluidic biochips that include test resource optimization and fault detection while running normal bioassays. Part III focuses on different reconfiguration-based defect tolerance techniques designed to increase the yield and dependability of digital microfluidic biochips. Expanding upon results from ongoing research on CAD for biochips at Duke University, this book presents new design methodologies that address some of the limitations in current full-custom design techniques. Digital Microfluidic Biochips is an essential resource for achieving the integration of microfluidic components in the next generation of system-on-chip and system-in-package designs.