This book describes the basic mechanisms, theory, simulations and technological aspects of Laser processing techniques. It covers the principles of laser quenching, welding, cutting, alloying, selective sintering, ablation, etc. The main attention is paid to the quantitative description. The diversity and complexity of technological and physical processes is discussed using a unitary approach. The book aims on understanding the cause-and-effect relations in physical processes in Laser technologies. It will help researchers and engineers to improve the existing and develop new Laser machining techniques. The book addresses readers with a certain background in general physics and mathematical analysis: graduate students, researchers and engineers practicing laser applications.

The chapters present the problems of stresses and strains induced in metals and nonmetals in the processes of laser heating, analyze the results, offer the ways of laser treatment that dispense with subsequent machining operations, and describe the basic approaches to increase the strength of materials during laser heating. Other topics include the practical methods of implementing the processes of laser welding, cutting, hardening, alloying, and cladding (hardfacing). Basics of Laser Material Processing is designed for scientific workers and for those students in senior- and graduate-level courses.

A study of the laser processing of materials and industrial applications. Papers include: laser drilling for improving circuit board manufacturing; laser ablation of PMMA doped with benzyl; and pulsed-laser deposition of high-purity TiN thin films.

Coverage of the most recent advancements and applications in laser materials processing This book provides state-of-the-art coverage of the field of laser materials processing, from fundamentals to applications to the latest research topics. The content is divided into three succinct parts: Principles of laser engineering-an introduction to the basic concepts and characteristics of lasers, design of their components, and beam delivery Engineering background&-a review of engineering concepts needed to analyze different processes: thermal analysis and fluid flow; solidification of molten metal; and residual stresses that evolve during processes Laser materials processing-a rigorous and detailed treatment of laser materials processing and its principle applications, including laser cutting and drilling, welding, surface modification, laser forming, and rapid prototyping Each chapter includes an outline, summary, and example sets to help readers reinforce their understanding of the material. This book is designed to prepare graduate students who will be entering industry; researchers interested in initiating a research program; and practicing engineers who need to stay abreast of the latest developments in this rapidly evolving field.

Laser processing of solid materials has been commonly performed in gas ambient. Having the workpiece immersed into liquid, having a liquid film on it, or soaking the material with liquid gives several advantages such as removal of the debris, lowering the heat load on the workpiece, and confining the vapour and plasma, resulting in higher shock pressure on the surface. Introduced in the 1980s, neutral liquids assisted laser processing (LALP) has proved to be advantageous in the cutting of heat-sensitive materials, shock peening of machine parts, cleaning of surfaces, fabrication of micro-optical components, and for generation of nanoparticles in liquids. The liquids used range from water through organic solvents to cryoliquids. The primary aim of Handbook of Liquids-Assisted Laser Processing is to present the essentials of previous research (tabulated data of experimental conditions and results), and help researchers develop new processing and diagnostics techniques (presenting data of liquids and a review of physical phenomena associated with LALP). Engineers can use the research results and technological innovation information to plan their materials processing tasks. Laser processing in liquids has been applied to a number of different tasks in various fields such as mechanical engineering, microengineering, chemistry, optics, and bioscience. A comprehensive glossary with definitions of the terms and explanations has been added. The book covers the use of chemically inert liquids under normal conditions. Laser chemical processing examples are presented for comparison only. - First book in this rapidly growing field impacting mechanical and micro/nano-engineering - Covers different kinds of liquid-assisted laser processing of a large variety of materials - Covers lasers emitting from UV to IR with pulse lengths down to femtoseconds - Reviews over 500 scientific articles and 300 inventions and tabulates their main features - Gives a qualitative and quantitative description of the physical phenomena associated with LALP - Tabulates 61 parameters for 100 liquids - Glossary of over 200 terms and abbreviations

Advances in Manufacturing and Processing of Materials and Structures cover the latest advances in materials and structures in manufacturing and processing including additive and subtractive processes. It's intended to provide a compiled resource that reviews details of the advances that have been made in recent years in manufacturing and processing of materials and structures. A key development incorporated within this book is 3D printing, which is being used to produce complex parts including composites with odd shape fibers, as well as tissue and body organs. This book has been tailored for engineers, scientists and practitioners in different fields such as aerospace, mechanical engineering, materials science and biomedicine. Biomimetic principles have also been integrated. Features Provides the latest state-of-the art on different manufacturing processes, including a biomimetics viewpoint Offers broad coverage of advances in materials and manufacturing Written by chapter authors who are world-class researchers in their respective fields Provides in-depth presentation of the latest 3D and 4D technologies related to various manufacturing disciplines Provides substantial references in each chapter to enhance further study

Plasma & High Frequency Processes for Obtaining & Processing Materials in the Nuclear Fuel Cycle

Laser processing is now a rapidly increasing field with many real and potential applications in different areas of technology such as micromecha nics, metallurgy, integrated optics, and semiconductor device fabrication. The neces s ity for such soph i st i cated 1 i ght sources as 1 asers is based on the spatial coherence and the monochromaticity of laser light. The spatial coherence permits extreme focussing of the laser light resulting in the availability of high energy densities which can be used for strongly loca lized heat- and chemical-treatment of materials, with a resolution down to 1 ess than 1 lJIll. When us i ng pul sed or scanned cw-l asers, 1 oca 1 i zat i on in time is also possible. Additionally, the monochromaticity of laser light allows for control of the depth of heat treatment and/or selective, nonthermal bond breaking - within the surface of the material or within the molecules of the surrounding reactive atmosphere - simply by tuning the laser wavelength. These inherent advantages of laser light permit micromachining of materials (drilling, cutting, welding etc.) and also allow single-step controlled area processing of thin films and surfaces. Processes include structural transformation (removal of residual damage, grain growth in polycrystalline material, amorphization, surface hardening etc.), etching, doping, alloying, or deposition. In addition, laser processing is not 1 imited to planar substrates.

As was the case in the two preceding workshops of 1969 and 1971, the Third Workshop on "Laser Interaction and Related Plasma Phenomena" held in 1973 was of international character. The main purpose was to review the advanced status of this particular and turbulent field of physics as it had developed vigorously in all major laboratories of the world since 1971. Due to recently accelerated advancements, it was hardly possible to present a com plete tutorial review; the subject is still in its premature stages and changing rapidly. A topical conference would have been too specific for a group of physicists with broad backgrounds working in the field or for those just about to enter it. It was the aim of the workshop and it is the aim of these proceedings to help this large group of scientists find their way within the highly complex and sometimes confusing results of a new field. We optimized the task of the workshop with extensive reviews on severa~ topics and at the same time included more detailed infor mation for specialists. The differences in their conclusions were not a matter of contention but rather served to complement the advanced results. As in the preceding workshops, we directed our attention toward critical realism in respect to the complexity of the field. What is meant here is exemplified in the contribution by R. Sigel W.667).