State-of-the-Art Coverage of the Most Widely Used Acceptance Sampling Techniques Cohesively Incorporates Theory and Practice Reflecting the recent resurgence of interest in this field, Acceptance Sampling in Quality Control, Second Edition presents the state of the art in the methodology of sampling and explores its advantages and limitations. The book also looks at how acceptance control can support applications of statistical process control and help in the evaluation of products. New to the Second Edition Coverage of ISO 2859 and 3951 standards and the ASTM version (E2234) of MIL-STD-105E A new section on credit-based sampling plans Greater emphasis on sampling schemes with switching rules More extensive discussion of accept zero plans, including tightened-normal-tightened (TNT), credit-based, the Nelson monograph for c=0, and MIL-STD-1916 Providing valuable guidelines for choosing appropriate procedures, this comprehensive second edition encompasses the most widely used acceptance sampling techniques. It lucidly provides a broad theoretical understanding of the field while offering all the information needed for the practical application of acceptance sampling plans in industry.

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

This book includes selected peer-reviewed papers presented at the International Conference on Modeling, Simulation and Optimization (CoMSO 2021), organized by National Institute of Technology, Silchar, Assam, India, during December 16–18, 2021. The book covers topics of modeling, simulation and optimization, including computational modeling and simulation, system modeling and simulation, device/VLSI modeling and simulation, control theory and applications, modeling and simulation of energy systems and optimization. The book disseminates various models of diverse systems and includes solutions of emerging challenges of diverse scientific fields.