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BOOK EXCERPT:
Product Details :
Genre |
: Semiconductor wafers |
Author |
: |
Publisher |
: |
Release |
: 1991 |
File |
: 524 Pages |
ISBN-13 |
: UOM:39015038577287 |
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BOOK EXCERPT:
Product Details :
Genre |
: Technology & Engineering |
Author |
: U. Gösele |
Publisher |
: The Electrochemical Society |
Release |
: 1998 |
File |
: 636 Pages |
ISBN-13 |
: 1566771897 |
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BOOK EXCERPT:
Product Details :
Genre |
: Technology & Engineering |
Author |
: Charles E. Hunt |
Publisher |
: The Electrochemical Society |
Release |
: 2001 |
File |
: 498 Pages |
ISBN-13 |
: 1566772583 |
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BOOK EXCERPT:
Product Details :
Genre |
: Technology & Engineering |
Author |
: H. Baumgart |
Publisher |
: The Electrochemical Society |
Release |
: 2002 |
File |
: 310 Pages |
ISBN-13 |
: 1566773601 |
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BOOK EXCERPT:
Product Details :
Genre |
: Science |
Author |
: Peter L. F. Hemment |
Publisher |
: The Electrochemical Society |
Release |
: 1996 |
File |
: 458 Pages |
ISBN-13 |
: 1566771536 |
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BOOK EXCERPT:
Product Details :
Genre |
: Microelectromechanical systems |
Author |
: |
Publisher |
: The Electrochemical Society |
Release |
: 2005 |
File |
: 476 Pages |
ISBN-13 |
: 1566774608 |
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BOOK EXCERPT:
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Product Details :
Genre |
: Technology & Engineering |
Author |
: Peter Ramm |
Publisher |
: John Wiley & Sons |
Release |
: 2012-02-13 |
File |
: 435 Pages |
ISBN-13 |
: 9783527326464 |
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BOOK EXCERPT:
Product Details :
Genre |
: Technology & Engineering |
Author |
: H. Baumgart |
Publisher |
: The Electrochemical Society |
Release |
: 2002 |
File |
: 310 Pages |
ISBN-13 |
: 1566773601 |
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BOOK EXCERPT:
Product Details :
Genre |
: Integrated circuits |
Author |
: |
Publisher |
: |
Release |
: 2004 |
File |
: 514 Pages |
ISBN-13 |
: 4886860605 |
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BOOK EXCERPT:
Product Details :
Genre |
: Integrated circuits |
Author |
: |
Publisher |
: |
Release |
: 2004 |
File |
: 512 Pages |
ISBN-13 |
: UIUC:30112043460820 |