In this Special Issue of Sensors, seven peer-reviewed manuscripts appear on the topic of ultrasonic transducer design and operation in harsh environments: elevated temperature, high gamma and neutron radiation fields, or the presence of aggressive chemicals. Motivations for these research and development projects are strongly focused on nuclear power plant inspections (particularly liquid-sodium cooled reactors), and nondestructive testing of high-temperature piping installations. It is anticipated that extensive use of permanently mounted robust transducers for in-service monitoring of petrochemical plants and power generations stations; quality control in manufacturing plants; and primary and secondary process monitoring in the fabrication of engineering materials will soon be made.

Provides unique coverage of wireless sensor system applications in space, underwater, underground, and extreme industrial environments in one volume This book covers the challenging aspects of wireless sensor systems and the problems and conditions encountered when applying them in outer space, under the water, below the ground, and in extreme industrial environments. It explores the unique aspects of designs and solutions that address those problems and challenges, and illuminates the connections, similarities, and differences between the challenges and solutions in those various environments. The creation of Wireless Sensor Systems for Extreme Environments is a response to the spread of wireless sensor technology into fields of health, safety, manufacturing, space, environmental, smart cities, advanced robotics, surveillance, and agriculture. It is the first of its kind to present, in a single reference, the unique aspects of wireless sensor system design, development, and deployment in such extreme environments—and to explore the similarities and possible synergies between them. The application of wireless sensor systems in these varied environments has been lagging dramatically behind their application in more conventional environments, making this an especially relevant book for investigators and practitioners in all of these areas. Wireless Sensor Systems for Extreme Environments is presented in five parts that cover: Wireless Sensor Systems for Extreme Environments—Generic Solutions Space WSS Solutions and Applications Underwater and Submerged WSS Solutions Underground and Confined Environments WSS Solutions Industrial and Other WSS Solutions This book is a welcome guide for researchers, post-graduate students, engineers and scientists who design and build operational and environmental control systems, emergency response systems, and situational awareness systems for unconventional environments.

The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.

Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.

This book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity. With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.

MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for aerospace applications, including devices for active drag reduction in aerospace applications, inertial navigation and structural health monitoring systems, and thrusters for nano- and pico-satellites. A selection of case studies are used to explore MEMS for harsh environment sensors in aerospace applications, before the book concludes by considering the use of MEMS in space exploration and exploitation.With its distinguished editors and international team of expert contributors, MEMS for automotive and aerospace applications is a key tool for MEMS manufacturers and all scientists, engineers and academics working on MEMS and intelligent systems for transportation. - Chapters consider the role of MEMS in a number of automotive applications, including passenger safety and comfort, vehicle stability and control - MEMS for aerospace applications are also discussed, including active drag reduction, inertial navigation and structural health monitoring systems - Presents a number of case studies exploring MEMS for harsh environment sensors in aerospace

This book presents the basic principles of optical sensor technology in line with the tremendous development in the concept of optical fibers. In the first four chapters, the book discusses the basic principles of optical sensor technology in a simplified manner, making it suitable for all levels of study and research. The seven remaining chapters are concerned with the practical applications of optical sensor technology in all fields such as oil and gas, civil engineering, medical and military fields and harsh environments.

This book describes for readers various technical outcomes from the EU-project IoSense. The authors discuss sensor integration, including LEDs, dust sensors, LIDAR for automotive driving and 8 more, demonstrating their use in simulations for the design and fabrication of sensor systems. Readers will benefit from the coverage of topics such as sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production, electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT-enabling systems, and IoT sensor system reliability. Describes from component to system level simulation, how to use the available simulation techniques for reaching a proper design with good performance; Explains how to use simulation techniques such as Finite Elements, Multi-body, Dynamic, stochastics and many more in the virtual design of sensor systems; Demonstrates the integration of several sensor solutions (thermal, dust, occupancy, distance, awareness and more) into large-scale system solutions in several industrial domains (Lighting, automotive, transport and more); Includes state-of-the-art simulation techniques, both multi-scale and multi-physics, for use in the electronic industry.