The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. - Provides basic and applied knowledge surrounding corrosion in electronics - Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms - Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level

The advent of Industry 4.0 has opened a data-rich avenue of predicting and controlling premature degradation of industrial materials. For any industrial construction or manufacturing projects, performing analysis on the structural integrity of materials is crucial for their sustainability. Corrosion Science: Modern Trends and Applications gives scholars a snapshot of recent contributions and development in the field of material corrosion. The book presents 12 chapters that cover topics such as corrosion testing methods, anti-corrosive coating mechanisms, corrosion in different types of products (electronics, polymers), industrial systems (power plants, concrete constructions, and hydraulic systems), and corrosion as a result of environmental characteristics (such as marine surroundings). The breadth of topics covered coupled with the reader-friendly presentation of the book make it highly beneficial for students, research scholars, faculty members, and R&D specialists working in the area of corrosion science, material science, solid-state science, chemical engineering, and nanotechnology. Readers will be equipped with the knowledge to understand and plan industrial processes that involve measuring the reliability and integrity of material structures which are impacted by corrosive factors.

Provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.