This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application

These proceedings present a review of the research being carried out in the field of amorphous insulating thin films. Topics discussed include: nitrides, structure and defects; hydrogen in MOS structures and oxides; silicon dioxide, charge trapping; and ONO and nitride oxides.

"Containing over 1, 400 articles, this is the most comprehensive encyclopedia of electrical engineering available. The articles were written and reviewed by an international group of engineers with academic or research affiliations. The entries are grouped into 64 broad categories such as solid-state circuits, fuzzy systems, and medical imaging. Mathematical explanations, tables, and graphics illustrate the articles. An extensive index by subject and keyword makes locating material easy. All of the articles have bibliographies. Larger public libraries and academic libraries with engineerings majors will find this to be a useful source."--" Outstanding reference sources 2000 ", American Libraries, May 2000. Comp. by the Reference Sources Committee, RUSA, ALA.

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology