This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

The integration of artificial intelligence (AI), quantum computing, and semiconductor technology offers improved innovation to redefine computational power and capabilities. As AI drives advances in machine learning and data processing, quantum computing revolutionizes problem-solving with its ability to handle complex calculations at improved speeds. Advancements in semiconductor technology push the limits of processing efficiency and miniaturization. Continued exploration on this convergence may accelerate breakthroughs in various fields such as cryptography, material science, and healthcare. Integration of AI, Quantum Computing, and Semiconductor Technology explores the intersection of artificial intelligence (AI) and semiconductor technology within the context of quantum computing. It offers a comprehensive analysis of the current advancements, challenges, and potential applications resulting from this convergence. This book covers topics such as cyber security, healthcare monitoring, and machine learning, and is a useful resource for computer engineers, energy scientists, business owners, healthcare administrators, environmental scientists, academicians, and researchers.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Discover the materials set to revolutionize the electronics industry The search for electronic materials that can be cheaply solution-processed into films, while simultaneously providing quality device characteristics, represents a major challenge for materials scientists. Continuous semiconducting thin films with large carrier mobilities are particularly desirable for high-speed microelectronic applications, potentially providing new opportunities for the development of low-cost, large-area, flexible computing devices, displays, sensors, and solar cells. To date, the majority of solution-processing research has focused on molecular and polymeric organic films. In contrast, this book reviews recent achievements in the search for solution-processed inorganic semiconductors and other critical electronic components. These components offer the potential for better performance and more robust thermal and mechanical stability than comparable organic-based systems. Solution Processing of Inorganic Materials covers everything from the more traditional fields of sol-gel processing and chemical bath deposition to the cutting-edge use of nanomaterials in thin-film deposition. In particular, the book focuses on materials and techniques that are compatible with high-throughput, low-cost, and low-temperature deposition processes such as spin coating, dip coating, printing, and stamping. Throughout the text, illustrations and examples of applications are provided to help the reader fully appreciate the concepts and opportunities involved in this exciting field. In addition to presenting the state-of-the-art research, the book offers extensive background material. As a result, any researcher involved or interested in electronic device fabrication can turn to this book to become fully versed in the solution-processed inorganic materials that are set to revolutionize the electronics industry.

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and III-V materials—this book addresses the state of the art in nano devices for electronics. It provides an all-encompassing, one-stop resource on the materials and device structures involved in the evolution from micro- to nanoelectronics. The book is divided into three parts that address: Semiconductor materials (i.e., carbon nanotubes, memristors, and spin organic devices) Silicon devices and technology (i.e., BiCMOS, SOI, various 3D integration and RAM technologies, and solar cells) Compound semiconductor devices and technology This reference explores the groundbreaking opportunities in emerging materials that will take system performance beyond the capabilities of traditional CMOS-based microelectronics. Contributors cover topics ranging from electrical propagation on CNT to GaN HEMTs technology and applications. Approaching the trillion-dollar nanotech industry from the perspective of real market needs and the repercussions of technological barriers, this resource provides vital information about elemental device architecture alternatives that will lead to massive strides in future development.