This book presents physics-based electro-thermal models of bipolar power semiconductor devices including their packages, and describes their implementation in MATLAB and Simulink. It is a continuation of our first book Modeling of Bipolar Power Semiconductor Devices. The device electrical models are developed by subdividing the devices into different regions and the operations in each region, along with the interactions at the interfaces, are analyzed using the basic semiconductor physics equations that govern device behavior. The Fourier series solution is used to solve the ambipolar diffusion equation in the lightly doped drift region of the devices. In addition to the external electrical characteristics, internal physical and electrical information, such as junction voltages and carrier distribution in different regions of the device, can be obtained using the models. The instantaneous dissipated power, calculated using the electrical device models, serves as input to the thermal model (RC network with constant and nonconstant thermal resistance and thermal heat capacity, or Fourier thermal model) of the entire module or package, which computes the junction temperature of the device. Once an updated junction temperature is calculated, the temperature-dependent semiconductor material parameters are re-calculated and used with the device electrical model in the next time-step of the simulation. The physics-based electro-thermal models can be used for optimizing device and package design and also for validating extracted parameters of the devices. The thermal model can be used alone for monitoring the junction temperature of a power semiconductor device, and the resulting simulation results used as an indicator of the health and reliability of the semiconductor power device.

Power Electrical Systems are an indespensable feature of the exploitation and diagnostics of elecrical machines and energy resources. The Volume presents extended and peer reviewed papers from the international conference on PES in Barcelona, 2014. Among the topics dealt with are: electrical machines design, voltage and control, automotive power drives, electromagnetic compatibility, monitoring and diagnostics, renewable energy systems. The International Conference on Power Electrical Systems (PES) is a forum for researchers and specialists in different fields of electrical engineering related to Hybrid Renewable Energy Systems (HRES); Power Electronics in Renewable Energy Systems; Topologies and Control of Power Electronics Converters Used in Renewable Energy Systems; Electric machines modelling and control; Automotive electrical systems; Electric machine design; Monitoring and diagnostics; Special machines; Power systems; Power electronic converters; Renewable energy systems; Variable speed drives; Electromagnetic compatibility; Variable speed generating systems; Transformers.

This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.

This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

This book presents physics-based electro-thermal models of bipolar power semiconductor devices including their packages, and describes their implementation in MATLAB and Simulink. It is a continuation of our first book Modeling of Bipolar Power Semiconductor Devices. The device electrical models are developed by subdividing the devices into different regions and the operations in each region, along with the interactions at the interfaces, are analyzed using the basic semiconductor physics equations that govern device behavior. The Fourier series solution is used to solve the ambipolar diffusion equation in the lightly doped drift region of the devices. In addition to the external electrical characteristics, internal physical and electrical information, such as junction voltages and carrier distribution in different regions of the device, can be obtained using the models. The instantaneous dissipated power, calculated using the electrical device models, serves as input to the thermal model (RC network with constant and nonconstant thermal resistance and thermal heat capacity, or Fourier thermal model) of the entire module or package, which computes the junction temperature of the device. Once an updated junction temperature is calculated, the temperature-dependent semiconductor material parameters are re-calculated and used with the device electrical model in the next time-step of the simulation. The physics-based electro-thermal models can be used for optimizing device and package design and also for validating extracted parameters of the devices. The thermal model can be used alone for monitoring the junction temperature of a power semiconductor device, and the resulting simulation results used as an indicator of the health and reliability of the semiconductor power device.

This book presents the reader, whether an electrical engineering student in power electronics or a design engineer, a selection of power converter control problems and their basic digital solutions, based on the most widespread digital control techniques. The presentation is primarily focused on different applications of the same power converter topology, the half-bridge voltage source inverter, considered both in its single- and three-phase implementation. This is chosen as the test case because, besides being simple and well known, it allows the discussion of a significant spectrum of the most frequently encountered digital control applications in power electronics, from digital pulse width modulation (DPWM) and space vector modulation (SVM), to inverter output current and voltage control, ending with the relatively more complex VSI applications related to the so called smart-grid scenario. This book aims to serve two purposes: (1) to give a basic, introductory knowledge of the digital control techniques applied to power converters; and (2) to raise the interest for discrete time control theory, stimulating new developments in its application to switching power converters.

The world energy demand has been increasing in a rapid manner with the increase of population and rising standard of living. The world population has nearly doubled in the last 40 years from 3.7 billion people to the present 7 billion people. It is anticipated that world population will grow towards 8 billion around 2030. Furthermore, the conventional fossil fuel supplies become unsustainable as the energy demand in emerging big economies such as China and India would rise tremendously where the China will increase its energy demand by 75% and India by 100% in the next 25 years. With dwindling natural resources, many countries throughout the world have increasingly invested in renewable resources such as photovoltaics (PV) and wind. The world has seen immense growth in global photovoltaic power generation over the last few decades. For example, in Australia, renewable resources represented nearly 15% of total power generation in 2013. Among renewable resources, solar and wind account for 38% of generation. In near future, energy in the domestic and industrial sector will become ""ubiquitous"" where consumers would have multiple sources to get their energy. Another such prediction is that co-location of solar and electrical storage will see a rapid growth in global domestic and industrial sectors; conventional power companies, which dominate the electricity market, will face increasing challenges in maintaining their incumbent business models. The efficiency, reliability and cost-effectiveness of the power converters used to interface PV panels to the mains grid and other types of off-grid loads are of major concern in the process of system design. This book describes state-of-the-art power electronic converter topologies used in various PV power conversion schemes. This book aims to provide a reader with a wide variety of topologies applied in different circumstances so that the reader would be able to make an educated choice for a given application.

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Computers play an important role in the analyzing and designing of modern DC-DC power converters. This book shows how the widely used analysis techniques of averaging and linearization can be applied to DC-DC converters with the aid of computers. Obtained dynamical equations may then be used for control design. The book is composed of two chapters. Chapter 1 focuses on the extraction of control-to-output transfer function. A second-order converter (a buck converter) and a fourth-order converter (a Zeta converter) are studied as illustrative examples in this chapter. Both ready-to-use software packages, such as PLECS® and MATLAB® programming, are used throught this chapter. The input/output characteristics of DC-DC converters are the object of considerations in Chapter 2. Calculation of input/output impedance is done with the aid of MATLAB® programming in this chapter. The buck, buck-boost, and boost converter are the most popular types of DC-DC converters and used as illustrative examples in this chapter. This book can be a good reference for researchers involved in DC-DC converters dynamics and control.

The 2nd volume of 'Advances in Microelectronics: Reviews' Book Series is written by 57 contributors from academy and industry from 11 countries (Bulgaria, Hungary, Iran, Japan, Malaysia, Romania, Russia, Slovak Republic, Spain, Ukraine and USA). The book contains 13 chapters from different areas of microelectronics: MEMS, materials characterization, and various microelectronic devices. With unique combination of information in each volume, the Book Series will be of value for scientists and engineers in industry and at universities. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.