The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineering problems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.

This invaluable second volume of a two-volume set is filled with details about the integrated circuit design for space applications. Various considerations for the selection and application of electronic components for designing spacecraft are discussed. The basic constructions of submicron transistors and schottky diodes during the technological process of production are explored. This book provides details on the energy consumption minimization methods for microelectronic devices. Specific topics include: Features and physical mechanisms of the effect of space radiation on all the main classes of microcircuits, including peculiarities of radiation impact on submicron integrated circuits;Special design, technology, and schematic methods of increasing the resistance to various types of space radiation;Recommendations for choosing research equipment and methods for irradiating various samples;Microcircuit designers on the composition of test elements for the study of the effect of radiation;Microprocessors, circuit boards, logic microcircuits, digital, analog, digital–analog microcircuits manufactured in various technologies (bipolar, CMOS, BiCMOS, SOI);Problems involved with designing high speed microelectronic devices and systems based on SOS-and SOI-structures;System-on-chip and system-in-package and methods for rejection of silicon microcircuits with hidden defects during mass production.

A field as diverse as optoelectronics needs a reference that is equally versatile. From basic physics and light sources to devices and state-of-the-art applications, the Handbook of Optoelectronics provides comprehensive, self-contained coverage of fundamental concepts and practical applications across the entire spectrum of disciplines encompassed by optoelectronics. The handbook unifies a broad array of current research areas with a forward-looking focus on systems and applications. Beginning with an introduction to the relevant principles of physics, materials science, engineering, and optics, the book explores the details of optoelectronic devices and techniques including semiconductor lasers, optical detectors and receivers, optical fiber devices, modulators, amplifiers, integrated optics, LEDs, and engineered optical materials. Applications and systems then become the focus, with sections devoted to industrial, medical, and commercial applications, communications, imaging and displays, sensing and data processing, spectroscopic analysis, the art of practical optoelectronics, and future prospects. This extensive resource comprises the efforts of more than 70 world-renowned experts from leading industrial and academic institutions around the world and includes many references to contemporary works. Whether used as a field reference, as a research tool, or as a broad and self-contained introduction to the field, the Handbook of Optoelectronics places everything you need in a unified, conveniently organized format.

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development